Abstract: An electrically conductive circuit member for use within a multilayered circuit board assembly wherein the member comprises a sheet of electrically conductive material (e.g., copper) and first and second layers of electrically insulative material (e.g., prepreg) bonded thereto to substantially encapsulate the conductive material therein. The conductive material includes a plurality of apertures and a plurality of elongated openings, which openings are mechanically provided in a predefined pattern to assure at least two electrically isolated regions within the singular, planar conductive material. A method of making this circuit member is also defined, said method not requiring the need for wet/chemical processing and the disadvantages associated therewith.