Patents by Inventor Carl Campbell Stringer

Carl Campbell Stringer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
    Publication number: 20260026286
    Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.
    Type: Application
    Filed: September 26, 2025
    Publication date: January 22, 2026
    Applicant: Applied Materials, Inc.
    Inventors: Kyle M. Hanson, Eric J. Bergman, Gregory J. Wilson, Paul R. McHugh, Benjamin Clay Bradley, Aaron Paul Juntunen, Deepak Saagar Kalaikadal, Daniel Durado, Carl Campbell Stringer, James Jay Tripp, Jason A. Rye, John L. Klocke
  • Electroplating wetting chamber with reduced bubble entrapment
    Patent number: 12469720
    Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: November 11, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Kyle M. Hanson, Eric J. Bergman, Gregory J. Wilson, Paul R. McHugh, Benjamin Clay Bradley, Aaron Paul Juntunen, Deepak Saagar Kalaikadal, Daniel Durado, Carl Campbell Stringer, James Jay Tripp, Jason A. Rye, John L. Klocke
  • ELECTROPLATING WETTING CHAMBER WITH REDUCED BUBBLE ENTRAPMENT
    Publication number: 20250006519
    Abstract: Method and systems for cleaning and wetting a semiconductor substrate, are provided. Methods and systems include forming an atmosphere in a basin housing the semiconductor substrate with a gas having a higher solubility in a wetting agent than oxygen. Methods and systems include spraying the wetting agent with a spray head onto the substrate while maintaining the atmosphere. Methods and systems include rotationally translating the semiconductor substrate, the spray head, or both the semiconductor substrate and the spray head, Methods and systems include wetting a plurality of features defined in the substrate.
    Type: Application
    Filed: June 28, 2023
    Publication date: January 2, 2025
    Applicant: Applied Materials, Inc.
    Inventors: Kyle M. Hanson, Eric J. Bergman, Gregory J. Wilson, Paul R. McHugh, Benjamin Clay Bradley, Aaron Paul Juntunen, Deepak Saagar Kalaikadal, Daniel Durado, Carl Campbell Stringer, James Jay Tripp, Jason A. Rye, John L. Klocke