Patents by Inventor Carl D'Acosta

Carl D'Acosta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
    Publication number: 20180082915
    Abstract: Air cavity packages and methods for producing air cavity packages containing sintered bonded components, multipart window frames, and/or other unique structural features are disclosed. In one embodiment, a method for fabricating an air cavity package includes the step or process of forming a first metal particle-containing precursor layer between a base flange and a window frame positioned over the base flange. A second metal particle-containing precursor layer is further formed between the base flange and a microelectronic device positioned over the base flange. The metal particle-containing precursor layers are sintered substantially concurrently at a maximum processing temperature less than melt point(s) of metal particles within the layers to produce a first sintered bond layer from the first precursor layer joining the window frame to the base flange and to produce a second sintered bond layer from the second precursor layer joining the microelectronic device to the base flange.
    Type: Application
    Filed: September 19, 2016
    Publication date: March 22, 2018
    Applicant: FREESCALE SEMICONDUCTOR INC.
    Inventors: LAKSHMINARAYAN VISWANATHAN, JAYNAL A. MOLLA, DAVID ABDO, MALI MAHALINGAM, CARL D'ACOSTA
  • Air cavity packages and methods for the production thereof
    Patent number: 9922894
    Abstract: Air cavity packages and methods for producing air cavity packages containing sintered bonded components, multipart window frames, and/or other unique structural features are disclosed. In one embodiment, a method for fabricating an air cavity package includes the step or process of forming a first metal particle-containing precursor layer between a base flange and a window frame positioned over the base flange. A second metal particle-containing precursor layer is further formed between the base flange and a microelectronic device positioned over the base flange. The metal particle-containing precursor layers are sintered substantially concurrently at a maximum processing temperature less than melt point(s) of metal particles within the layers to produce a first sintered bond layer from the first precursor layer joining the window frame to the base flange and to produce a second sintered bond layer from the second precursor layer joining the microelectronic device to the base flange.
    Type: Grant
    Filed: September 19, 2016
    Date of Patent: March 20, 2018
    Assignee: NXP USA, INC.
    Inventors: Lakshminarayan Viswanathan, Jaynal A. Molla, David Abdo, Mali Mahalingam, Carl D'Acosta