Abstract: A method of testing the diaphragm portion of the die before the pressure sensor is assembled is disclosed. A mechanical pressure is exerted upon the diaphragm equivalent to any desired atmospheric pressure. The electrical output of the die is then measured to determine if it is within an acceptable range. If the electrical output is not within the acceptable range the resistors of the die can be trimmed at that time, prior to assembly.

Abstract: A solid state semiconductor pressure sensor is described in which the pressure sensor element is protected from the ambient whose pressure is being measured by a combination of a pressure transfer medium and a thin covering membrane. A method is described for applying the thin covering membrane so as to substantially avoid entrapment of air or formation of voids in the pressure transfer medium which would degrade the performance of the sensor. The pressure transfer medium is a gel-like material such as a silastic. The membrane is chosen to be substantially impermeable to the ambients being measured and sufficiently flexible to be rolled across the surface of the assembly during fabrication and to avoid attenuation of the input pressure signal. Fluorosilicone is an example of a suitable membrane material.

Abstract: A method of manufacturing optically sensitive semiconductor devices in which an anti-reflective coating is provided without the addition of mask or etch steps to the manufacturing process flow. A single layer of silicon nitride is patterned to provide an anti-reflective coating over the active area of the optically sensitive device and to form the dielectric of any capacitors also a part of the integrated circuit. An oxide passivation layer is used so that it may be opened over the active area without disturbing the anti-reflective coating.