Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

Abstract: An optical phase profilometry system includes a first operative coaxial camera-projector pair aligned at a first angle relative to a target surface that projects a first illumination on the target surface and a second operative coaxial camera-projector pair aligned at a second angle relative to the target surface that projects a second illumination on the target surface. Wherein the first and second angles are equal and opposite to one another relative to the target surface such that the second operative coaxial camera-projector pair is configured to capture a first reflection from the first illumination and the first operative coaxial camera-projector pair is configured to capture a second reflection from the second illumination. The optical phase profilometry system further includes a controller configured to, based on the captured first and second reflections, generate a first and second estimation of the target surface and combine them to generate a dimensional profile of the target surface.

Abstract: A system for generating a three-dimensional height image of a reflective test target includes an illumination source configured to generate a patterned illumination on the test target, an imaging system configured to acquire an image of the patterned illumination on the test target, and a variable focus optical system configured to cause the camera to image the test target with at least two distinct focus positions, the illumination source and camera being aligned relative to the test target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source, the camera and the variable focus optical system, the controller being configured to generate a height image of the test target based on the acquired image of the patterned illumination using at least two distinct focal positions.

Abstract: A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

Abstract: A computer-implemented method of and system for measuring a three-dimensional surface are provided. The method includes projecting structured illumination on the surface and acquiring a plurality of sets of images. The sets of images are processed to obtain a plurality of point clouds. A spatial accumulator is defined. A first point cloud of the plurality of point clouds is combined with a second point cloud of the plurality of point clouds into the spatial accumulator. Spatial coordinates of the surface are generated based on the contents of the spatial accumulator.

Abstract: A method of calibrating a three-dimensional measurement system having a plurality of cameras and at least one projector is provided. The method includes performing a full calibration for each camera/projector pair where the full calibration generates at least two sets of correction matrices. Subsequently, an updated calibration is performed for each camera/projector pair. The updated calibration changes less than all of the sets of correction matrices.

Abstract: A three-dimensional non-contact scanning system is provided. The system includes a stage and at least one scanner configured to scan an object on the stage. A motion control system is configured to generate relative motion between the at least one scanner and the stage. A controller is coupled to the at least one scanner and the motion control system. The controller is configured to perform a field calibration where an artifact having features with known positional relationships is scanned by the at least one scanner in a plurality of different orientations to generate sensed measurement data corresponding to the features. Deviations between the sensed measurement data and the known positional relationships are determined. Based on the determined deviations, a coordinate transform is calculated for each of the at least one scanner where the coordinate transform reduces the determined deviations.

Abstract: A method of calibrating a three-dimensional measurement system having a plurality of cameras and at least one projector is provided. The method includes performing a full calibration for each camera/projector pair where the full calibration generates at least two sets of correction matrices. Subsequently, an updated calibration is performed for each camera/projector pair. The updated calibration changes less than all of the sets of correction matrices.

Abstract: A computer-implemented method of and system for measuring a three-dimensional surface are provided. The method includes projecting structured illumination on the surface and acquiring a plurality of sets of images. The sets of images are processed to obtain a plurality of point clouds. A spatial accumulator is defined. A first point cloud of the plurality of point clouds is combined with a second point cloud of the plurality of point clouds into the spatial accumulator. Spatial coordinates of the surface are generated based on the contents of the spatial accumulator.

Abstract: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

Abstract: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion.

Abstract: A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

Abstract: An optical inspection system for inspecting a substrate is provided. The system includes an array of cameras configured to acquire a plurality of sets of images as the substrate and the array undergo relative motion with respect to each other. At least one focus actuator is operably coupled to each camera of the array of cameras to cause displacement of at least a portion of each camera that affects focus. A substrate range calculator is configured to receive at least portions of images from the array and to calculate range between the array of cameras and the substrate. A controller is coupled to the array of cameras and to the range calculator. The controller is configured to provide a control signal to each of the at least one focus actuator to adaptively focus each camera of the array during the relative motion.

Abstract: An optical inspection system is provided for inspecting a workpiece including a feature to be inspected. The system includes a workpiece transport configured to transport the workpiece in a nonstop manner. An illuminator is configured to provide a first strobed illumination field type and a second strobed illumination field type. The illuminator includes a light pipe having a first end proximate the feature, and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end has an exit aperture and the second end has at least one second end aperture to provide a view of the feature therethrough. An array of cameras is configured to digitally image the feature. The array of cameras is configured to generate a first plurality of images of the feature with the first illumination field and a second plurality of images of the feature with the second illumination field.