Patents by Inventor Carl E. Sklenicka

Carl E. Sklenicka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mass reflowable windowed package
    Patent number: 6191359
    Abstract: A windowed package is capable of withstanding a mass reflow process. During mass reflow, the entire package is subjected to the solder reflow temperature. In one embodiment, the lid comprises a ceramic frame and a glass window.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: February 20, 2001
    Assignee: Intel Corporation
    Inventors: Kabul S. Sengupta, Carl E. Sklenicka, Deborah L. Thompson, Raul A. Arellano, Naoyuki Nagai, Nobuyuki Takehashi, Kouichiro Nomoto