Abstract: A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

Abstract: Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

Abstract: Slices are cut from workpieces during a sequence of cut-off operations by a wire saw, having a wire array. The wire array is tensioned in a plane between two wire guide rollers supported between fixed and floating bearings. During each cut-off operation, a workpiece is fed through the wire array perpendicular to a workpiece axis and the wire array plane. The workpiece is fed with simultaneous axial movement of the floating bearings by adjusting a temperature of the fixed bearings in correlation with a first correction profile, which specifies a travel of the floating bearings in dependence on the depth of cut. In dependence on the depth of cut, operating parameters are set, such as the feed rate, an amount of working fluid fed to the wire array per unit time, a temperature of the working fluid, a wire speed, a wire consumption per cut-off operation, or a wire tension.

Abstract: The invention relates to a method for separating a plurality of slices from workpieces (4) by means of a wire saw, wherein a wire grating (2) is tensioned in a plane between two wire-guiding rollers (1), wherein each of the two wire-guiding rollers (1) is mounted between a fixed bearing (5) and a floating bearing (6). The method involves delivering the workpiece (4) via the wire grating (2) by controlling the temperature of the workpiece (4) by wetting the workpiece (4) with a cooling medium, while simultaneously axially shifting the floating bearing (6) by controlling the temperature of the fixed bearing (5) with a cooling fluid according to the specification of a first temperature profile, and while simultaneously shifting the workpiece (4) along the workpiece axis by means of a control element (15) according to the specification of a second correction profile.

Abstract: A method uses a wire saw to cut slices from a workpiece. The wire saw has an array of saw wire tensioned in a plane between two rollers supported between fixed and floating bearings. During a cut-off operation, the workpiece is fed through the wire array with simultaneous axial movement of the floating bearings by adjusting the temperature of the fixed bearings with a cooling fluid in accordance with the temperature of the cooling fluid being in dependence on a depth of cut and correlating with a first correction profile, which specifies the travel of the floating bearings in dependence on the depth of cut. Also, the workpiece is fed through the wire array while simultaneously moving the workpiece along the workpiece axis in accordance with a second correction profile, specifying the travel of the workpiece. The first and second correction profiles are opposed to a shape deviation.

Abstract: Semiconductor wafers with improved geometry are produced from a workpiece by processing the workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires which are tensioned between wire guide rollers and move in a running direction; producing kerfs when the wires engage into the workpiece; determining a placement error of the kerfs; and inducing a compensating movement of the workpiece as a function of the determined placement error along a longitudinal axis of the workpiece during the feeding of the workpiece through the arrangement of wires.