Patents by Inventor Carl Hess

Carl Hess has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11348222
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: May 31, 2022
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Patent number: 10713771
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Grant
    Filed: April 25, 2018
    Date of Patent: July 14, 2020
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Publication number: 20200074619
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the water in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Application
    Filed: November 7, 2019
    Publication date: March 5, 2020
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Publication number: 20180247403
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Application
    Filed: April 25, 2018
    Publication date: August 30, 2018
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Patent number: 9710903
    Abstract: Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided. One system is configured to detect design defects and process defects at locations on a wafer at which images are acquired by an electron beam review subsystem based on defects in a design, additional defects in the design, which are detected by comparing an image of a die in the design printed on the wafer acquired by the electron beam review subsystem to an image of the die stored in a database, and defects detected on the wafer by a wafer inspection system.
    Type: Grant
    Filed: June 5, 2009
    Date of Patent: July 18, 2017
    Assignee: KLA-Tencor Corp.
    Inventors: Christophe Fouquet, Zain Saidin, Sergio Edelstein, Savitha Nanjangud, Carl Hess
  • Patent number: 9208552
    Abstract: A semiconductor inspection apparatus performs a hybrid inspection process including cell-to-cell inspection, die-to-die inspection and die-to-golden or die-to-database inspection. The apparatus creates a golden image of a reticle complimentary to portions of the reticle that can be inspected by cell-to-cell inspection or die-to-die inspection. Alternatively, the apparatus creates a reduced database complimentary to portions of the reticle that can be inspected by cell-to-cell inspection or die-to-die inspection.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: December 8, 2015
    Assignee: KLA-Tencor Corporation
    Inventors: Carl Hess, John D. Miller, Shan Xue, Patrick LoPresti
  • Publication number: 20150178914
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Application
    Filed: March 4, 2015
    Publication date: June 25, 2015
    Inventors: Paul Frank Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess
  • Patent number: 9002497
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: April 7, 2015
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: William Volk, James Wiley, Sterling Watson, Sagar A. Kekare, Carl Hess, Paul Frank Marella, Sharon McCauley, Ellis Chang
  • Patent number: 8914754
    Abstract: A semiconductor inspection apparatus identifies regions of a reticle or semiconductor wafer appropriate for cell-to-cell inspection by analyzing a semiconductor design database. Appropriate regions can be identified in a region map for use by offline inspection tools.
    Type: Grant
    Filed: April 23, 2012
    Date of Patent: December 16, 2014
    Assignee: KLA-Tencor Corporation
    Inventors: Carl Hess, John D. Miller, Shi Rui-Fang, Chun Guan
  • Patent number: 8810646
    Abstract: A system and method for detecting defects on a reticle is disclosed. The method may comprise determining a best focus setting for imaging the reticle; obtaining a first image of the reticle, the first image obtained at the best focus setting plus a predetermined offset; obtaining a second image of the reticle, the second image obtained at the best focus setting minus the predetermined offset; generating a differential image, the differential image representing a difference between the first image and the second image; and identifying a defect on the reticle based on the differential image. The method in accordance with the present disclosure may also be utilized for detecting defects on at least a portion of the reticle.
    Type: Grant
    Filed: October 3, 2011
    Date of Patent: August 19, 2014
    Assignee: KLA-Tencor Corporation
    Inventor: Carl Hess
  • Publication number: 20130279792
    Abstract: A semiconductor inspection apparatus performs a hybrid inspection process including cell-to-cell inspection, die-to-die inspection and die-to-golden or die-to-database inspection. The apparatus creates a golden image of a reticle complimentary to portions of the reticle that can be inspected by cell-to-cell inspection or die-to-die inspection. Alternatively, the apparatus creates a reduced database complimentary to portions of the reticle that can be inspected by cell-to-cell inspection or die-to-die inspection.
    Type: Application
    Filed: April 23, 2012
    Publication date: October 24, 2013
    Applicant: KLA-Tencor Corporation
    Inventors: Carl Hess, John D. Miller, Shan Xue, Patrick LoPresti
  • Publication number: 20130111417
    Abstract: A semiconductor inspection apparatus identifies regions of a reticle or semiconductor wafer appropriate for cell-to-cell inspection by analyzing a semiconductor design database. Appropriate regions can be identified in a region map for use by offline inspection tools.
    Type: Application
    Filed: April 23, 2012
    Publication date: May 2, 2013
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Carl Hess, John D. Miller, Shi Rui-Fang, Chun Guan
  • Patent number: 8204297
    Abstract: Methods and systems for classifying defects detected on a reticle are provided. One method includes determining an impact that a defect detected on a reticle will have on the performance of a device being fabricated on a wafer based on how at least a portion of the reticle prints or will print on the wafer. The defect is located in the portion of the reticle. The method also includes assigning a classification to the defect based on the impact.
    Type: Grant
    Filed: February 27, 2009
    Date of Patent: June 19, 2012
    Assignee: KLA-Tencor Corp.
    Inventors: Yalin Xiong, Carl Hess
  • Publication number: 20120086799
    Abstract: A system and method for detecting defects on a reticle is disclosed. The method may comprise determining a best focus setting for imaging the reticle; obtaining a first image of the reticle, the first image obtained at the best focus setting plus a predetermined offset; obtaining a second image of the reticle, the second image obtained at the best focus setting minus the predetermined offset; generating a differential image, the differential image representing a difference between the first image and the second image; and identifying a defect on the reticle based on the differential image. The method in accordance with the present disclosure may also be utilized for detecting defects on at least a portion of the reticle.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 12, 2012
    Applicant: KLA-TENCOR CORPORATION
    Inventor: Carl Hess
  • Patent number: 8151220
    Abstract: Various computer-implemented methods are provided. One method for generating a process for inspecting reticle layout data includes identifying a first region in the reticle layout data. A printability of the first region is more sensitive to changes in process parameters than a printability of a second region in the reticle layout data. The method also includes assigning one or more inspection parameters to the first region and the second region such that the first region will be inspected during the process with a higher sensitivity than the second region. Another method includes inspecting the first region with a higher sensitivity than the second region. An additional method includes simulating how the reticle layout data will print. Simulation of the first and second regions is performed with one or more different simulation parameters such that the first region is simulated with a higher fidelity than the second region.
    Type: Grant
    Filed: December 3, 2004
    Date of Patent: April 3, 2012
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Carl Hess, Yalin Xiong
  • Patent number: 8102408
    Abstract: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.
    Type: Grant
    Filed: June 28, 2007
    Date of Patent: January 24, 2012
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Gaurav Verma, Bo Su, William Volk, Harold Lehon, Carl Hess
  • Publication number: 20110276935
    Abstract: Various systems and methods for detecting design and process defects on a wafer, reviewing defects on a wafer, selecting one or more features within a design for use as process monitoring features, or some combination thereof are provided.
    Type: Application
    Filed: June 5, 2009
    Publication date: November 10, 2011
    Applicant: KLA-TENCOR CORPORATION
    Inventors: Christophe Fouquet, Zain Saidin, Sergio Edelstein, Savitha Nanjangud, Carl Hess
  • Patent number: 7646906
    Abstract: Computer-implemented methods for detecting defects in reticle design data are provided. One method includes generating a first simulated image illustrating how the reticle design data will be printed on a reticle using a reticle manufacturing process. The method also includes generating second simulated images using the first simulated image. The second simulated images illustrate how the reticle will be printed on a wafer at different values of one or more parameters of a wafer printing process. The method further includes detecting defects in the reticle design data using the second simulated images. Another method includes the generating steps described above in addition to determining a rate of change in a characteristic of the second simulated images as a function of the different values. This method also includes detecting defects in the reticle design data based on the rate of change.
    Type: Grant
    Filed: January 31, 2005
    Date of Patent: January 12, 2010
    Assignee: KLA-Tencor Technologies Corp.
    Inventors: Zain K. Saidin, Yalin Xiong, Lance Glasser, Carl Hess, Moshe E. Preil
  • Patent number: 7493590
    Abstract: Optical proximity correction methods and apparatus are disclosed. A simulated geometry representing one or more printed features from a reticle is generated using an optical proximity correction (OPC) model that takes into account a reticle design and one or more parameters from a process window of a stepper. An error function is formed that measures a deviation between the simulated geometry and a desired design of the one or more printed features. The error function takes into account parameters (p0 . . . pJ) from across the process window in addition to, or in lieu of, a best focus and a best exposure for the stepper. The reticle design is adjusted in a way that reduces the deviation as measured by the error function, thereby producing an adjusted reticle design.
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: February 17, 2009
    Assignee: KLA-Tencor Technologies Corporation
    Inventors: Carl Hess, Ruifang Shi, Gaurav Verma
  • Publication number: 20080081385
    Abstract: Methods and systems for inspection of wafers and reticles using designer intent data are provided. One computer-implemented method includes identifying nuisance defects on a wafer based on inspection data produced by inspection of a reticle, which is used to form a pattern on the wafer prior to inspection of the wafer. Another computer-implemented method includes detecting defects on a wafer by analyzing data generated by inspection of the wafer in combination with data representative of a reticle, which includes designations identifying different types of portions of the reticle. An additional computer-implemented method includes determining a property of a manufacturing process used to process a wafer based on defects that alter a characteristic of a device formed on the wafer. Further computer-implemented methods include altering or simulating one or more characteristics of a design of an integrated circuit based on data generated by inspection of a wafer.
    Type: Application
    Filed: November 14, 2007
    Publication date: April 3, 2008
    Inventors: Paul Marella, Sharon McCauley, Ellis Chang, William Volk, James Wiley, Sterling Watson, Sagar Kekare, Carl Hess