Abstract: A liquid crystal display (LCD) includes a first panel assembly and a second panel assembly with a liquid crystal material layer therebetween. The first panel assembly has a resonant frequency substantially the same as the second panel assembly's. The first panel assembly has substantially matched mechanical properties to the second panel assembly. Each of the assemblies may include a support panel, such as provided by a glass plate. A front assembly, may also include at least one filter panel. The LCD may also include a frame mounted around a periphery of the first and second panel assemblies. The first panel assembly has a coefficient of thermal expansion substantially the same as a coefficient of thermal expansion of the second panel assembly. The frame also has a coefficient of thermal expansion substantially the same as the coefficient of thermal expansion of the first and second panel assemblies.

Abstract: A liquid crystal display (LCD) includes a first panel assembly and a second panel assembly with a liquid crystal material layer positioned therebetween, and wherein the first panel assembly has a resonant frequency substantially the same as a resonant frequency of the second panel assembly so that the LCD is resistant to damage from vibration. The first panel assembly preferably includes a first cover panel immediately adjacent the liquid crystal material layer and at least one additional panel positioned adjacent the first cover panel. Similarly, the second assembly may include a second cover panel immediately adjacent the layer of liquid crystal material and at least one additional panel adjacent the second cover panel. The first panel assembly has substantially matched mechanical properties to the second panel assembly. For example, the substantially matched mechanical properties preferably include a stiffness to mass ratio. In addition, the resonant frequency is preferably a first mode resonant frequency.

Abstract: A liquid crystal display (LCD) includes a first panel assembly and a second panel assembly with a liquid crystal material layer positioned therebetween, and wherein the first panel assembly has a resonant frequency substantially the same as a resonant frequency of the second panel assembly so that the LCD is resistant to damage from vibration. The first panel assembly preferably includes a first cover panel immediately adjacent the liquid crystal material layer and at least one additional panel positioned adjacent the first cover panel Similarly, the second assembly may include a second cover panel immediately adjacent the layer of liquid crystal material and at least one additional panel adjacent the second cover panel. The first panel assembly has substantially matched mechanical properties to the second panel assembly. For example, the substantially matched mechanical properties preferably include a stiffness to mass ratio. In addition, the resonant frequency is preferably a first mode resonant frequency.

Abstract: A printed circuit card housing provides separate cooling fluid travel paths for convectively cooling on-board heat exchangers of non mil. spec. component-retaining printed circuit cards, and for thermal conductive cooling of conventional (VME) circuit cards, while keeping both types of circuit cards sealed from contaminants that may be present in the cooling fluid. The housing includes a chassis having a card slot cavity, into which both types of printed circuit cards are retained. A cooling fluid supply/exhaust plenum provides a first cooling fluid travel path that is ported to only convectively cooled circuit cards. In order to cool the remaining circuit cards, the cooling fluid supply/exhaust plenum ports cooling fluid entering the plenum along a second cooling fluid travel path through heat exchangers installed along sidewalls of the chassis.

Abstract: A printed circuit card housing provides separate cooling fluid travel paths for convectively cooling on-board heat exchangers of non mil. spec. component-retaining printed circuit cards, and for thermal conductive cooling of conventional (VME) circuit cards, while keeping both types of circuit cards sealed from contaminants that may be present in the cooling fluid. The housing includes a chassis having a card slot cavity, into which both types of printed circuit cards are retained. A cooling fluid supply/exhaust plenum provides a first cooling fluid travel path that is ported to only convectively cooled circuit cards. In order to cool the remaining circuit cards, the cooling fluid supply/exhaust plenum ports cooling fluid entering the plenum along a second cooling fluid travel path through heat exchangers installed along sidewalls of the chassis.

Abstract: A housing structure for retaining and cooling a plurality of printed circuit boards includes an arrangement of parallel electrical connectors, which receive associated connectors mounted to respective ones of the printed circuit boards. Integrated with each printed circuit board is a respective frame-configured thermally conductive heat exchanger, that abuts a first side of the printed circuit board. A second side of the printed circuit board contains circuit components to be cooled. Cooling fluid flowing through the adjacent chambers of the heat exchanger draws heat away from the circuit components. A cooling fluid supply and removal plenum is coupled to adjacent fluid inlet and exhaust ports provided at a top end wall of the heat exchanger.

Abstract: A sealed housing for cooling a plurality of printed circuit cards includes a chassis that supports a plurality of electrical connectors retaining printed circuit cards in mutually adjacent, spatially separated relationship. A first side of a respective printed circuit card is attached to an associated convectively cooled heat exchanger, having a cooling fluid flow chamber containing thermally conductive heat exchange elements through which an internal cooling fluid flows. A sealed, forced cooling fluid recirculation structure is mounted to the chassis and recirculates cooling fluid through heat exchangers of respective printed circuit cards. The sealed, internal cooling fluid recirculation structure contains thermally conductive heat exchangers that are convectively coupled with the internal cooling fluid and are conductively coupled to a distribution of thermally conductive fins on the outside of the chassis.

Abstract: A retractable radome assembly is comprised of a number of hollow casings having successively smaller transverse dimensions, disposed to permit nesting of a smaller dimension casing within a next adjacent larger dimension casing in a vacuum sealing relationship and in such a manner as to permit relative mobility of adjacent casings in a coaxial telescoping manner from a fully retracted to a fully extended coaxial position. The casing sections are maintained in the fully extended position through forces created by a differential pressure between the outside atmosphere and a vacuum atmosphere provided within the casing wall structure, the radome being maintained in the fully retracted position through the use of mechanical retracting assembly applied in the absence of a vacuum atmosphere within the wall structure.