Abstract: A dry-wet thermal management system for providing simultaneous spray cooling and dry cooling for a plurality of cards. The dry-wet thermal management system includes a chassis having a dry chamber and a spray chamber, a first opening within a rear portion of the chassis extending into the spray chamber, a second opening within the rear portion of the chassis extending into the dry chamber, and a main backplane secured and sealed to the rear portion of the chassis. Electronic cards may be electrically coupled within sockets of the main backplane within both the dry chamber and the spray chamber. The cards within the spray chamber are typically high heat flux components with increased cooling requirements and the cards within the dry chamber are typically low heat flux components with reduced cooling requirements. A spray cool system is within the spray chamber and a dry cool system is within the dry chamber.

Abstract: The invention relates to a device for removing heat from an electronic component mounted on a circuit board. The device uses a working fluid circulated through cooling elements which are integrated into a metal matrix composite structure. The cooling elements are positioned and arranged within the structure to efficiently manage heat dissipation by evacuating the heat from the component in a multi-directional manner.

Abstract: The invention relates to a method of installing a heat source on a micro heat pipe module and to a micro heat pipe module. The micro heat pipe module (1) has micro heat pipes (3) for dissipating the thermal energy generated by the heat source (2) generating thermal energy, and the micro heat pipe module (1) has a side (4) on which the heat source (2) generating thermal energy is installed. The side (4) of the micro heat pipe module (1), on which the heat source (2) generating thermal energy is installed, is coated with a coating (5) made of a heat conducting material, which coating (5) is arranged to conduct the heat generated by the heat source (2) generating thermal energy away from the heat source (2) generating thermal energy along said side (4) of the micro heat pipe module (1) and to the micro heat pipe module (1).

Abstract: The invention relates to an arrangement for dissipating thermal energy generated by a heat source (1), which arrangement comprises a heat conductor element (2) for conducting thermal energy generated by the heat source (1) away from the heat source (1), the heat conductor element (2) having at least one micro heat pipe module (3) attached to it for distributing thermal energy generated by the heat source (1) in the heat conductor element (2). The heat source (1) is attached to an element (4) which is made of a heat conducting material and which is in thermal contact with the heat conductor element (2) and which is arranged to conduct thermal energy from the heat source (1) to the heat conductor element (2) by means of the heat conducting ability of said heat conducting material.

Abstract: The invention relates to a cooling apparatus (10) based on heat energy bound to working fluid in phase transition, the cooling apparatus comprising, for conducting elsewhere the heat energy generated by an electronic component (7), elongated cooling elements (1; 6a, 6b; 9a-9f) containing working fluid and extending in at least two different directions forming a matrix of cooling elements, and a heat conducting material (8; 15) binding the matrix of the cooling elements. The cooling elements (6a, 6b; 9a-9f) are arranged parallel to a circuit board level (A) and in at least one direction deviating from the circuit board level (A).