Abstract: Various embodiments of an electronic assembly with increased standoff height are provided. In one exemplary embodiment, a substrate is provided. A metallic interconnection land is disposed over the substrate. A solder resist material is applied on a predefined portion of the metallic interconnection land. A metallic solder material is disposed over at least a portion of the solder resist material and contacts a surface of the metallic interconnection land. An air pocket is formed within the metallic solder material over at least a portion of solder resist material. The air pocket acts as a lifting mechanism to increase a standoff height between the substrate and a surface mount component.

Abstract: A method, computer program product and network management server for distributing software. The network management server receives a request to deploy an application on a designated target client station at a designated scheduled time. The network management server determines whether to deploy the application on the designated target client station at the designated time based on the resource state of the systems involved in the deployment of the software (e.g., processor usage of the network management server, processor usage of the target client station) as well as the environmental conditions (e.g., bandwidth usage, time of day pricing for connectivity at scheduled time, work orders on the target client station). By taking into consideration the dynamic resource state of the systems involved in the deployment of the software as well as the environmental conditions, software may be deployed on the client stations by the network management server more effectively.