Patents by Inventor Carl Ludwig Deppisch

Carl Ludwig Deppisch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CLAD SOLDER THERMAL INTERFACE MATERIAL
    Publication number: 20110147438
    Abstract: A clad solder thermal interface material is described. In one example the material has a first layer of solder, a second layer of solder clad to the first layer of solder, the second layer having a melting temperature lower than the melting temperature of the first layer, and a third layer of solder clad to the first layer of solder opposite the second layer, the third layer having a melting temperature lower than the melting temperature of the first layer.
    Type: Application
    Filed: December 23, 2009
    Publication date: June 23, 2011
    Inventors: Carl Ludwig Deppisch, Rajasekaran Swaminathan