Abstract: The present invention provides a configurable dc-dc power converter module and method of manufacture for such module. The power converter module comprises an isolated subassembly with a capacitor bank, control circuits and an isolated power train that converts an input voltage to an intermediate bus voltage. The power module further comprises multiple non-isolated power trains electrically coupled to the isolated subassembly that are powered by the intermediate bus voltage to produce output voltages. The number of output voltages is determined by the number of populated non-isolated power trains, which may include all of the non-isolated power trains in the power module or a subset thereof. In one embodiment of the invention the non-isolated power trains are located on a carrier PWB that is electrically coupled to the bus PWB.

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract: A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.

Abstract: The present invention provides a configurable dc-dc power converter module and method of manufacture for such module. The power converter module comprises an isolated subassembly with a capacitor bank, control circuits and an isolated power train that converts an input voltage to an intermediate bus voltage. The power module further comprises multiple non-isolated power trains electrically coupled to the isolated subassembly that are powered by the intermediate bus voltage to produce output voltages. The number of output voltages is determined by the number of populated non-isolated power trains, which may include all of the non-isolated power trains in the power module or a subset thereof. In one embodiment of the invention the non-isolated power trains are located on a carrier PWB that is electrically coupled to the bus PWB.

Abstract: A dual footprint mounting package for a surface mount power converter modules and its method of manufacture. Castellated regions are formed on the edge of the component package using the appropriate sized drill or milling bit. Edge plating is applied to the castellated surfaces to create edge pads. The edge plating provides electrical continuity between the edge pads and the SMT pads. Solder mask, or other materials, is applied to prevent solder from wicking between each SMT pad and its respective edge pad. Such component may be attached to a larger device PWB using either the edge pads or the SMT pads, or may even be attached using a combination of the two, such as in the event of a pad failure or other defect.

Abstract: The present invention provides a heat dissipater for use on a circuit board. The invention includes a circuit board having components on at least one side, a rigid plate having thermal conductive properties, and a spring clip that couples said rigid plate to said circuit board and provides a retaining force against the rigid plate. Both the rigid plate and spring clip provide thermal paths to ambient for the circuit board, and in one embodiment, a heat sink or cold plate may be coupled to the rigid plate. Thermal interface material may be filled in between the rigid plate, circuit board and spring clip to provide an efficient thermal path to ambient. The rigid plate, spring clip, and thermal interface material may be electrically insulated.

Abstract: The present invention provides a DC-DC power converter that comprises two or more Printed Wiring Boards (PWB) mounted parallel to one another and without encapsulation. Electronic components can be mounted on both sides of each board. The open design and parallel orientation of the PWBs allow airflow over components mounted on the PWBs. The PWBs are preferable made of FR-4 with copper foils, with one thicker board being comprised of more copper layers and the other boards comprised of less copper layers. In the preferred embodiment, the power processing elements are housed in the thicker PWB, while the thinner boards house the control circuitry.

Abstract: The adapter couples a power module to a circuit board. An adapter embodying the present invention can be configured to allow the connection of any power module regardless of pin out to any circuit board. Signal modifying circuitry can also be added to the adapter to enhance or simply modify the signal to the end user's circuit board. The modifying circuitry can act on either the input to the adapter or the output from the adapter. At least one conductive path couples the input interconnects and the output interconnects.

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.

Abstract: A power supply with a protection circuit that protects against over current, short circuit, output overvoltage, and input undervoltage with a minimal number of components. A pulse width modulated power supply has a controller using two operational amplifiers, namely an error amplifier and an overvoltage comparator, which are used to limit the duty cycle of the power supply. When the output voltage differs significantly from a reference, the overvoltage comparator triggers causing the supply to enter hiccup mode wherein it shuts off and automatically restarts, checking to see if the condition which caused shutdown is still present.

Abstract: A power supply with a protection circuit that protects against over current, short circuit, output overvoltage, and input undervoltage with a minimal number of components. A pulse width modulated power supply has a controller using two operational amplifiers, namely an error amplifier and an overvoltage comparator, which are used to limit the duty cycle of the power supply. When the output voltage differs significantly from a reference, the overvoltage comparator triggers causing the supply to enter hiccup mode wherein it shuts off and automatically restarts, checking to see if the condition which caused shutdown is still present.

Abstract: The adapter couples a power module to a circuit board. An adapter embodying the present invention can be configured to allow the connection of any power module regardless of pin out to any circuit board. Signal modifying circuitry can also be added to the adapter to enhance or simply modify the signal to the end user's circuit board. The modifying circuitry can act on either the input to the adapter or the output from the adapter. At least one conductive path couples the input interconnects and the output interconnects.

Abstract: This improved surface mount power supply can withstand the rigors of the manufacturing process and still create sturdy and robust connection to a user's circuit card. The open frame power module uses a U-shaped or T-shaped interconnect rather than a spherical interconnect. In one embodiment, the U-shaped interconnect can have a hole through one surface to allow the wicking of solder. The wicked solder provides a sturdier connection that is more likely to survive subsequent reflow processes. The power module is also built on a thicker FR4 board. The thicker board is less likely to warp during subsequent heating.