Abstract: An electronic device package (10) is resistant to rupture at high temperatures. The electronic device package (10) includes a cap (14) having side-walls (18) coupled to a support structure (11) via an adhesive (15). The cap (14) is permeable to gases including water vapor. The side-walls (18) of the cap (14) are made of a porous ceramic material which absorbs a portion of the adhesive (15) via capillary action while curing the adhesive (15).

Abstract: A controlled collapse chip connection device can be heat sinked in the following manner. A carbon composition heat sink (102) having a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the controlled collapse connection chip device (101) is positioned in a proximate location to a fabricated thermal mating area (104) of the controlled collapse chip connection device (101). The carbon composition heat sink (102) is then thermally bonded to the thermal mating area (104) of the controlled collapse connection chip device (101).

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract: An electronic device package includes a portion that functions as a membrane to allow small molecules, such as gas molecules, to relatively freely traverse the housing boundary, while simultaneously substantially preventing large molecules, such as liquid molecules, from entering the confines of the housing. As a result, the package can be readily used in reflow processing without risking damage to the boundary integrity between the housing and the support surface that supports both the electronic device and the housing.

Abstract: An improved omega connector for electrically coupling components of a multicomponent electronic assembly comprises first and second flat end sections each formed of nonporous copper plate adapted for solder bonding to components, and an intermediate loop section formed of interwoven copper fibers extending between the end sections to provide a continous electrically conductive network therebetween. The fibers in the loop section carry a solder nonwettable coating to avoid interference with bonding operations to attach the end section to the components. Preferably, the loop section is composed of nickel-clad copper fibers. The fibrous loop section exhibits enhanced flexibility to reduce stresses attributed to shifting of the components during operation and thereby extend the useful life of the assembly.

Abstract: An improved interconnection for mounting an electrical component to a substrate, such as a printed circuit board or the like, comprises an interwoven copper film mat embedded within a solder alloy matrix. The solder alloy is bonded to the component and to the substrate and extends continuously therebetween to provide a strong mechanical joint. The copper mat enhances electrical and thermal conductivity through the interconnection and improves compliant to relieve stresses of the type generated by differential thermal expansion of the component and the substrate during use.

Abstract: A broadband RF transformer design is described that facilitates the construction of a broadband impedance transformer in a compact, planar format, while retaining ease of assembly and manufacture. Broadband operation is achieved through the use of a slotted low-impedance winding structure, common-manufacture ferrite elements, and the optional placement of reactive elements between winding turns. By virtue of construction, thermal performance is enhanced, allowing operation at power levels not previously possible. The invention accommodates functional tuning via laser or abrading techniques. Also, the winding configuration eliminates the need to access the center of a spiral for the purposes of establishing a ground connection.

Abstract: A distributed resonator stripline circulator is disclosed wherein a geometrically shaped resonator pattern is deposited upon a like geometrically shaped ferrite substrate. A ground plane is deposited upon the opposing side of the substrate which includes grounding wrap-arounds that extend partially onto the resonator face of the substrate. Two such resonators are assembled, resonator patterns facing, to form a stripline circulator. The grounding wrap-arounds provide electrical connection from the top ground plane to the bottom ground plane to provide superior isolation and control of circulator loading factors.