Abstract: A solder paste stencil printing apparatus and method for applying a controlled pattern and volume of solder paste onto a single area array component site on a populated printed circuit board (PCB). The stencil is a disposable, adhesive-backed, flexible, polymer membrane. The stencil has a plurality of holes in a pattern corresponding to a component site pad pattern on a printed circuit board. A periphery area of the stencil can be folded or shaped to fit into the available space to be stenciled. The method of applying the solder paste to the PCB includes shaping the stencil to fit available space, removing protective adhesive backer layer, aligning stencil with mating pad pattern on the PCB, and adhering stencil to PCB surface. The secure stencil insures efficient, accurate alignment and secure gasketing of stencil apertures to PCB pad pattern. Solder paste is then dispensed onto stencil surface, squeegeed across stencil surface until all apertures are filled level with top surface.

Abstract: A report cover with a display device comprising at least two sheets hingedly connected for folding as an inside cover and a third sheet hingedly connected to one of said aforementioned sheets and acting as the bottom cover, said first two mentioned sheets when folded having substantially coextensive confronting surfaces, printed circuits on the confronting surfaces embodying contact areas engageable by pressing the sheets together to complete a current path in the circuitry, cell means on the confronting face of the one sheet, terminal means on the confronting face of the other sheet, the poles of said cell means being engageable with said terminal means by pressing the sheets together to insert a source of current in the circuitry, a light emitting diode connected in the circuitry adapted to be energized by completion of a current path by pressing a pair of confronting contact areas together, means on the outer face of the one sheet indicative of the location poles and the contact areas at the inner side of