Abstract: A robotic assistant comprises a plurality of sensors in a compact and unobtrusive form. One or more sensors may be emplaced upon a mast that may be selectively raised and lowered. The mast allows the robotic assistant to acquire images or other sensor data from a greater height, without substantially increasing the bulk of the robotic assistant. For ease of transport from one floor to another or from one building to another, the robotic assistant may deploy a handhold that a human may use to pick up and carry the robotic assistant. Floor characterization sensors may be used to determine characteristics of the floor such as if the floor is wet or dry. The robotic assistant may be used to provide a user with access to network services, to monitor a facility, provide telepresence services, and so forth.

Abstract: An extensible mast device allows a payload to be supported at a controllable distance from a supporting device. A motor driving a flexible strip provides a force through the flexible strip to extend the mast. The extended strip may have a curved cross section that provides some rigidity. A set of telescoping sections may enclose the strip. One or more of the sections may be flexible. In the event of an impact between the extensible mast and an object, such as a user, the flexible section and the strip yield to the impact and collapse. The extensible mast may be easily reset by lifting it back to a vertical position, with the flexible strip reasserting the curved cross section and the flexible sections resuming substantially the same shape as before the impact. A robot may use the extensible mast to elevate cameras or other sensors to a higher vantage point.

Abstract: A flexible housing for a flexible electronic device is coupled to a cover lens for enclosing components disposed between the flexible housing and the cover lens. The flexible housing includes a flexible polymer substrate. A first metal layer covering at least a portion of the flexible polymer substrate. A second metal layer is disposed on the first metal layer. A protective coating covers the second metal layer.

Abstract: Systems, methods, and computer-readable media are disclosed for water resistant connectors having conductive elements. In one embodiment, an example water resistant connector may include a first connector with a first conductive layer and a first water resistant layer adjacent to the first conductive layer, and a circuit component with a second conductive layer positioned on a first side of the circuit component, and a second water resistant layer adjacent to the second conductive layer. The first conductive layer and the second conductive layer may be in contact in a connected configuration.

Abstract: Displays are described. One display having a light guide, and a multilayer structure. The light guide is disposed on a top side of the reflective display. The multilayer structure is disposed on the light guide. The multilayer structure includes: a first optically clear adhesive (OCA) layer disposed on the light guide; a black ink layer disposed on the first OCA layer; an first layer disposed on the black ink layer; a polymer layer disposed on the first layer; and a second OCA layer disposed on the polymer layer.

Abstract: Thin film devices and methods for forming the same are disclosed herein. A method for forming a thin film device includes forming a first at least semi-conductive strip located at a first height relative to a surface of a substrate, and forming a second at least semi-conductive strip adjacent to the first at least semi-conductive strip. The second strip is located at a second height relative to the substrate surface, and the second height is different than the first height. A nano-gap is formed between the first and second at least semi-conductive strips.

Abstract: An aspect of the present invention is a method for forming a plurality of thin-film devices. The method includes coarsely patterning at least one thin-film material on a flexible substrate and forming a plurality of thin-film elements on the flexible substrate with a self-aligned imprint lithography (SAIL) process.

Abstract: An aspect of the present invention is a logical arrangement of memory arrays. The logical arrangement includes a plurality of memory arrays deposed in a row-column configuration, a controller coupled to the plurality of memory arrays and at least one power line, at least one sense line and at least one address line coupled to the controller wherein a number of connections from the controller to the at least one power line, the at least one sense line and the at least one address line is minimized.

Abstract: The invention includes a memory cell apparatus, and a method of forming the memory cell. The memory cell apparatus includes a flexible hybrid memory element. The flexible hybrid memory element includes a flexible first conductive layer formed adjacent to a flexible substrate. A flexible diode structure is formed adjacent to the flexible first conductor. A flexible switch is formed adjacent to the flexible diode structure. A flexible second conductive layer is formed adjacent to the flexible switch. The flexible switch is generally formed from an organic material. The flexible diode structure is generally formed from a disordered, inorganic material. The flexible switch can be formed to create a high resistance path when a threshold amount of current is passed through the flexible switch, or the flexible switch can be formed to create a low resistance path when a threshold amount of current is passed through the flexible switch.

Abstract: The invention includes a method and system for forming a semiconductor device. The invention involves the utilization of a stamping tool to generate three-dimensional resist structures whereby thin film patterning steps can be transferred to the resist in a single molding step and subsequently revealed in later processing steps. Accordingly, the alignments between successive patterning steps can be determined by the accuracy with which the stamping tool has been fabricated, regardless of the dilations or contractions that can take place during the fabrication process. A first aspect of the invention includes a method for forming a semiconductor device. The method comprises providing a substrate, depositing a first layer of material over the substrate and forming a 3-dimensional (3D) resist structure over the substrate wherein the 3D resist structure comprises a plurality of different vertical heights throughout the structure.

Abstract: The invention includes a memory cell apparatus, and a method of forming the memory cell. The memory cell apparatus includes a flexible hybrid memory element. The flexible hybrid memory element includes a flexible first conductive layer formed adjacent to a flexible substrate. A flexible diode structure is formed adjacent to the flexible first conductor. A flexible switch is formed adjacent to the flexible diode structure. A flexible second conductive layer is formed adjacent to the flexible switch. The flexible switch is generally formed from an organic material. The flexible diode structure is generally formed from a disordered, inorganic material. The flexible switch can be formed to create a high resistance path when a threshold amount of current is passed through the flexible switch, or the flexible switch can be formed to create a low resistance path when a threshold amount of current is passed through the flexible switch.