Patents by Inventor Carl Phillip Taussig

Carl Phillip Taussig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and system for forming a semiconductor device
    Patent number: 6861365
    Abstract: A method and system for forming a semiconductor device is provided. The method and system involves the utilization of a stamping tool to generate three-dimensional resist structures whereby thin film patterning steps can be transferred to the resist in a single molding step and subsequently revealed in later processing steps. Accordingly, the alignments between successive patterning steps can be determined by the accuracy with which the stamping tool has been fabricated, regardless of the dilations or contractions that can take place during the fabrication process.
    Type: Grant
    Filed: June 28, 2002
    Date of Patent: March 1, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Carl Phillip Taussig, Ping Mei