Patents by Inventor Carl R. Reid

Carl R. Reid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12194533
    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, cause the processor to access a 3D model of a 3D object to be fabricated and apply a deformation model to the 3D model. In some examples, the processor may generate a modified 3D model that compensates for a determined deformation of the 3D object during a sintering process for the 3D object. In some examples, the deformation model may include a densification component associated with a density of the 3D object and a deformation component associated with mechanical loads on the 3D object. The densification component may have initial state values associated with the density of the 3D object during the sintering process.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: January 14, 2025
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Carl R. Reid, Daniel Fradl
  • Publication number: 20220326682
    Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, cause the processor to access a 3D model of a 3D object to be fabricated and apply a deformation model to the 3D model. In some examples, the processor may generate a modified 3D model that compensates for a determined deformation of the 3D object during a sintering process for the 3D object. In some examples, the deformation model may include a densification component associated with a density of the 3D object and a deformation component associated with mechanical loads on the 3D object. The densification component may have initial state values associated with the density of the 3D object during the sintering process.
    Type: Application
    Filed: October 22, 2019
    Publication date: October 13, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Carl R. Reid, Daniel Fradl
  • Publication number: 20040169709
    Abstract: In accordance with one embodiment, a printing device includes a sub-assembly for positioning ink on a print media. The printing device also includes a conditioning sub-assembly having a plurality of components, wherein the plurality of components has a first configuration to transfer conditioning material to the print media as the print media is fed through the printing device and a second configuration that does not transfer conditioning material to the print media as the print media is fed through the printing device.
    Type: Application
    Filed: February 28, 2003
    Publication date: September 2, 2004
    Inventors: Geoff Wotton, Carl R. Reid, Ernesto Garay
  • Patent number: 5825278
    Abstract: A thermal cutoff having a single switch blade that is held in a contacts-closed position under bending stress by a thermal pellet and that moves to a contacts-open position solely by relief of the bending stress upon melting of the thermal pellet.
    Type: Grant
    Filed: September 27, 1996
    Date of Patent: October 20, 1998
    Assignee: Therm-O-Disc, Incorporated
    Inventors: Carl R. Reid, David Lanham, Matt M. Grist, James B. Kalapodis