Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

Abstract: Methods of making a printed structure include providing a target substrate, coating the target substrate with an uncured adhesive, disposing a component on the uncured adhesive, processing the uncured adhesive with or without a pattern, and curing the uncured adhesive. Some embodiments include having a target-substrate contact pad on the target substrate, disposing a post component on the uncured adhesive over the target-substrate contact pad, the post component having an electrical connection extending from the post component toward the target-substrate contact pad, disposing a non-post component on the uncured adhesive laterally displaced from the post component, pattern-wise processing the uncured adhesive so that a first portion of the uncured adhesive adjacent to the post component is not processed and a second portion of the uncured adhesive adjacent to the non-post component is processed, reflowing the unprocessed first portion of the uncured adhesive, and curing the uncured adhesive.

Abstract: A micro-component substrate structure includes a carrier substrate having a corrugated surface and a micro-component having a bottom surface disposed on the corrugated surface. Only a portion of the micro-component bottom surface is in direct contact with the corrugated surface. The micro-component can be removed from the corrugated surface using micro-transfer printing without a tether or anchor structure in the carrier substrate using a stamp with stamp posts. The corrugated surface can be coated with a film. The stamp posts and film can be PDMS and can have different adhesive qualities or areas in contact with the micro-component. The film can be processed to modify its adhesive qualities.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: A composite laminate heating tool broadly comprising a substructure, a facesheet, and number of expansion joints. The substructure supports the facesheet but does not need to have the same or a similar CTE as the facesheet because the facesheet is free to expand relative to the substructure. The expansion joints provide an interface between the facesheet and the substructure so that the facesheet can thermally expand relative to the substructure while being fully supported by the substructure. Each expansion joint includes a guide attached to the substructure and a support member translatable relative to the guide and aligned radially from a centroid or center of expansion of the facesheet so as to have a single degree of freedom.

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

Abstract: An external tire reader can be configured to read a tire tread. The external tire reader can include an offset structure, a camera system, and a controller. The offset structure can be configured to be applied to the tire tread. The camera system can be configured to generate an image of the tire tread while the offset structure is applied to the tire tread. The offset structure can be configured to provide a fixed distance between the camera system and the tire tread while the offset structure is applied to the tire tread. The controller can be coupled with the camera system. The controller can be configured to process the image of the tire received from the camera system.

Abstract: The key fob charger is the only product of its kind that enables users to conveniently recharge their vehicle’s key fob through a magnetic USB connection, a wireless charging pad, and even an average home adapter. This unprecedented product is uniquely designed with cutting-edge, highly advanced technologies and durable materials to ensure long term sustainability, in addition, the key fob charger can be installed into all vehicles with a push start ignition to enhance and improve overall driver experience.

Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.

Abstract: A string trimmer lighting system includes a string trimmer having a motor, a handle, an elongated shaft, a debris shield, and a trimmer head; and a lighting device having a light source enclosed within a housing, an elongated member, a clamp, and one or more enclosure fasteners; wherein the housing includes a lens, a power switch, and a power source; wherein the light source emits light through the lens; wherein the elongated member removably attaches the housing to the clamp; wherein the clamp removably receives the elongated shaft; wherein the one or more enclosure fasteners removably tighten the clamp around the elongated shaft.

Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

Abstract: A waterfowl decoy animation device comprising a frame having a first elongated frame member and a second elongated frame member configured in a cruciform configuration, a first pulley wheel rotatably attached to a first end of the first frame member, a second pulley wheel rotatably attached to a second end of the first frame member, a third pulley wheel rotatably attached to a first end of the second frame member, and a fourth pulley wheel rotatably attached to a second end of the second frame member; a drive motor operatively associated with one of the pulley wheels; a drive belt around the pulley wheels; an electric source operatively associated with the drive motor; and at least one waterfowl decoy attached to the drive belt.

Abstract: The present invention is directed to a pre-coated substrate, such as a slide, that is useful for immobilizing a sample. The invention is further provides methods of preparing such pre-coated substrates and methods of analyzing biological samples immobilized on such pre-coated substrate. The substrate is coated with a polycationic polymeric coating material specifically selected such that that coated substrate exhibits increased stability and prolonged shelf-life. Preferred polymeric coating materials include allylic or vinylic polymers having cationic groups thereon and having no more than a small percentage of peptidic monomeric linkages, particularly polydiallyldimethylammonium (PDDA).

Abstract: The present invention is directed to a pre-coated substrate, such as a slide, that is useful for immobilizing a sample. The invention is further provides methods of preparing such pre-coated substrates and methods of analyzing biological samples immobilized on such pre-coated substrate. The substrate is coated with a polycationic polymeric coating material specifically selected such that that coated substrate exhibits increased stability and prolonged shelf-life. Preferred polymeric coating materials include allylic or vinylic polymers having cationic groups thereon and having no more than a small percentage of peptidic monomeric linkages, particularly polydiallyldimethylammonium (PDDA).

Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.

Abstract: Often, ticket brokers exploit fans. With transaction fees as much as 35% and substantial ticket markups by this $15.1 billion-dollar industry, fans face an enormous challenge when purchasing tickets to sporting events using this avenue referred to as the “secondary ticket market”. Far too long have fans waited for a level playing field in respects to purchasing tickets. Due to their greed; brokers, scalpers, and corporate exchangers have suppressed many fans' desires to attend the most popular sporting events. I have created a new ticket exchange concept that rewards fans for being fans and will not compromise the leagues profitability. This new concept will pioneer a more enthusiastic fan base that desires the in-game experience.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.

Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.