Patents by Inventor Carl Ray Prevatte, JR.
Carl Ray Prevatte, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230341296Abstract: An external tire reader can be configured to read a tire tread. The external tire reader can include an offset structure, a camera system, and a controller. The offset structure can be configured to be applied to the tire tread. The camera system can be configured to generate an image of the tire tread while the offset structure is applied to the tire tread. The offset structure can be configured to provide a fixed distance between the camera system and the tire tread while the offset structure is applied to the tire tread. The controller can be coupled with the camera system. The controller can be configured to process the image of the tire received from the camera system.Type: ApplicationFiled: March 1, 2021Publication date: October 26, 2023Inventors: Michael STANGLER, Shady Tarek EL BASSIOUNY, Steven NOYCE, Aaron Daniel FRANKLIN, David Alan KOESTER, Carl Ray Prevatte, JR.
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Publication number: 20230343630Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: ApplicationFiled: April 27, 2023Publication date: October 26, 2023Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Patent number: 11670533Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: GrantFiled: July 6, 2020Date of Patent: June 6, 2023Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Publication number: 20220368306Abstract: A method of printing comprises providing a component source wafer comprising components, a transfer device, and a patterned substrate. The patterned substrate comprises substrate posts that extend from a surface of the patterned substrate. Components are picked up from the component source wafer by adhering the components to the transfer device. One or more of the picked-up components are printed to the patterned substrate by disposing each of the one or more picked-up components onto one of the substrate posts, thereby providing one or more printed components in a printed structure.Type: ApplicationFiled: May 11, 2021Publication date: November 17, 2022Inventors: Matthew Alexander Meitl, Christopher Andrew Bower, Salvatore Bonafede, Carl Ray Prevatte, JR., Ronald S. Cok, Brook Raymond
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Patent number: 11393730Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: GrantFiled: September 3, 2020Date of Patent: July 19, 2022Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
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Patent number: 11387153Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: GrantFiled: September 3, 2020Date of Patent: July 12, 2022Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
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Patent number: 11024608Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.Type: GrantFiled: July 18, 2018Date of Patent: June 1, 2021Assignee: X Display Company Technology LimitedInventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, Jr., António José Marques Trindade, Tanya Yvette Moore
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Publication number: 20200402869Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: ApplicationFiled: September 3, 2020Publication date: December 24, 2020Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
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Publication number: 20200402870Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: ApplicationFiled: September 3, 2020Publication date: December 24, 2020Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
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Patent number: 10832935Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: GrantFiled: August 8, 2018Date of Patent: November 10, 2020Assignee: X Display Company Technology LimitedInventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Publication number: 20200335381Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: ApplicationFiled: July 6, 2020Publication date: October 22, 2020Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, JR.
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Patent number: 10796971Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: GrantFiled: August 13, 2018Date of Patent: October 6, 2020Assignee: X Display Company Technology LimitedInventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
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Patent number: 10749093Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: GrantFiled: October 22, 2019Date of Patent: August 18, 2020Assignee: X Display Company Technology LimitedInventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.
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Publication number: 20200052152Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.Type: ApplicationFiled: August 13, 2018Publication date: February 13, 2020Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
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Publication number: 20200052176Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: ApplicationFiled: October 22, 2019Publication date: February 13, 2020Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
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Patent number: 10510937Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.Type: GrantFiled: November 9, 2018Date of Patent: December 17, 2019Assignee: X-Celeprint LimitedInventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.
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Publication number: 20190157532Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electrical component over the substrate surface to electrically contact the connection post to the notch conductor.Type: ApplicationFiled: November 9, 2018Publication date: May 23, 2019Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
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Publication number: 20190051552Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.Type: ApplicationFiled: August 8, 2018Publication date: February 14, 2019Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
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Patent number: 10163735Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.Type: GrantFiled: December 4, 2017Date of Patent: December 25, 2018Assignee: X-Celeprint LimitedInventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl, Carl Ray Prevatte, Jr.
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Patent number: 10153257Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.Type: GrantFiled: March 10, 2017Date of Patent: December 11, 2018Assignee: X-Celeprint LimitedInventors: Ronald S. Cok, Christopher Andrew Bower, Matthew Meitl, Carl Ray Prevatte, Jr., Salvatore Bonafede, Robert R. Rotzoll