Patents by Inventor Carl Ray Prevatte, JR.

Carl Ray Prevatte, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11024608
    Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: June 1, 2021
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, Jr., António José Marques Trindade, Tanya Yvette Moore
  • Publication number: 20200402869
    Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
  • Publication number: 20200402870
    Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
  • Patent number: 10832935
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 10, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Publication number: 20200335381
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, JR.
  • Patent number: 10796971
    Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: October 6, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, Jr., Brook Raymond
  • Patent number: 10749093
    Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.
    Type: Grant
    Filed: October 22, 2019
    Date of Patent: August 18, 2020
    Assignee: X Display Company Technology Limited
    Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.
  • Publication number: 20200052176
    Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.
    Type: Application
    Filed: October 22, 2019
    Publication date: February 13, 2020
    Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
  • Publication number: 20200052152
    Abstract: A method of making a repaired electrical connection structure comprises providing a substrate having first and second contact pads electrically connected in parallel, providing first and second functionally identical components, disposing a first adhesive layer on the substrate, transferring the first component onto the first adhesive layer, electrically connecting the first component to the first contact pad, testing the first component to determine if the first component is a faulty component and, if the first component is a faulty component, disposing a second adhesive layer on the substrate and transferring the second component onto the second adhesive layer, and electrically connecting the second component to the second contact pad. The first and second adhesive layers can be unpatterned or patterned and the first and second components can be electrically connected to the first and second contact pads, respectively, with connection posts or photolithographically defined electrodes.
    Type: Application
    Filed: August 13, 2018
    Publication date: February 13, 2020
    Inventors: Ronald S. Cok, Erich Radauscher, Salvatore Bonafede, Christopher Andrew Bower, Matthew Alexander Meitl, Carl Ray Prevatte, JR., Brook Raymond
  • Patent number: 10510937
    Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electronic component over the substrate surface to electrically contact the connection post to the notch conductor.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: December 17, 2019
    Assignee: X-Celeprint Limited
    Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, Jr.
  • Publication number: 20190157532
    Abstract: A transfer print structure comprises a destination substrate having a substrate surface and one or more substrate conductors disposed on or in the destination substrate. One or more interconnect structures are disposed on and protrude from the destination substrate in a direction orthogonal to the substrate surface. Each interconnect structure comprises one or more notches, each notch having an opening on an edge of the interconnect structure and extending at least partially through the interconnect structure in a direction parallel to the substrate surface from the edge and a notch conductor disposed at least partially in the notch and electrically connected to one of the substrate conductors. In some embodiments, an electronic component comprising connection posts is transfer printed into electrical contact with a corresponding notch conductor by laterally moving the electrical component over the substrate surface to electrically contact the connection post to the notch conductor.
    Type: Application
    Filed: November 9, 2018
    Publication date: May 23, 2019
    Inventors: Matthew Meitl, Tanya Yvette Moore, Ronald S. Cok, Salvatore Bonafede, Brook Raymond, Christopher Andrew Bower, Carl Ray Prevatte, JR.
  • Publication number: 20190051552
    Abstract: An exemplary wafer structure comprises a source wafer having a patterned sacrificial layer defining anchor portions separating sacrificial portions. A patterned device layer is disposed on or over the patterned sacrificial layer, forming a device anchor on each of the anchor portions. One or more devices are disposed in the patterned device layer, each device disposed entirely over a corresponding one of the one or more sacrificial portions and spatially separated from the one or more device anchors. A tether structure connects each device to a device anchor. The tether structure comprises a tether device portion disposed on or over the device, a tether anchor portion disposed on or over the device anchor, and a tether connecting the tether device portion to the tether anchor portion. The tether is disposed at least partly in the patterned device layer between the device and the device anchor.
    Type: Application
    Filed: August 8, 2018
    Publication date: February 14, 2019
    Inventors: Christopher Andrew Bower, Matthew Meitl, Salvatore Bonafede, Brook Raymond, Carl Ray Prevatte, Jr.
  • Patent number: 10163735
    Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: December 25, 2018
    Assignee: X-Celeprint Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl, Carl Ray Prevatte, Jr.
  • Patent number: 10153257
    Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.
    Type: Grant
    Filed: March 10, 2017
    Date of Patent: December 11, 2018
    Assignee: X-Celeprint Limited
    Inventors: Ronald S. Cok, Christopher Andrew Bower, Matthew Meitl, Carl Ray Prevatte, Jr., Salvatore Bonafede, Robert R. Rotzoll
  • Publication number: 20180323178
    Abstract: An exemplary micro-device and substrate structure includes a destination substrate and one or more contact pads disposed thereon, a micro-device disposed on or over the destination substrate, and a layer of cured adhesive disposed on the destination substrate. The micro-device comprises at least one electrical contact. The at least one electrical contact is in direct electrical contact with the one or more contact pads. The adhesive layer adheres the micro-device to the destination substrate and is in contact with the one or more contact pads. An exemplary method of making a micro-device and substrate structure includes providing a destination substrate and one or more contact pads disposed thereon, coating a layer of curable adhesive, disposing a micro-device comprising at least one electrical contact on the layer and curing the layer thereby directly electrically contacting the at least one electrical contact with the one or more contact pads.
    Type: Application
    Filed: July 18, 2018
    Publication date: November 8, 2018
    Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, Jr., António José Marques Trindade, Tanya Yvette Moore
  • Patent number: 10103069
    Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: October 16, 2018
    Assignee: X-Celeprint Limited
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl, Carl Ray Prevatte, Jr.
  • Publication number: 20180286734
    Abstract: A method of micro-transfer printing a micro-device from a support substrate comprises providing the micro-device, forming a pocket in or on the support substrate, providing a release layer over the micro-device or the pocket, optionally providing a base layer on a side of the release layer opposite the micro-device, disposing the micro-device in the pocket with the release layer between the micro-device and the support substrate so that no portion of the support substrate or the optional base layer is in contact with the micro-device, etching the release layer to completely separate the micro-device from the support substrate or the optional base layer, providing a stamp having a conformable stamp post and pressing the stamp post against the separated micro-device to adhere the micro-device to the stamp post, and removing the stamp and micro-device from the support substrate.
    Type: Application
    Filed: March 27, 2018
    Publication date: October 4, 2018
    Inventors: Matthew Meitl, Brook Raymond, Ronald S. Cok, Christopher Andrew Bower, Salvatore Bonafede, Erich Radauscher, Carl Ray Prevatte, JR., António José Marques Trindade, Tanya Yvette Moore
  • Publication number: 20180090394
    Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.
    Type: Application
    Filed: December 4, 2017
    Publication date: March 29, 2018
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl, Carl Ray Prevatte, JR.
  • Publication number: 20170287789
    Abstract: A printed electrical connection structure includes a substrate having one or more electrical connection pads and a micro-transfer printed component having one or more connection posts. Each connection post is in electrical contact with a connection pad. A resin is disposed between and in contact with the substrate and the component. The resin has a reflow temperature less than a cure temperature. The resin repeatedly flows at the reflow temperature when temperature-cycled between an operating temperature and the reflow temperature but does not flow after the resin is exposed to a cure temperature. A solder can be disposed on the connection post or the connection pad. After printing and reflow, the component can be tested and, if the component fails, another component is micro-transfer printed to the substrate, the resin is reflowed again, the other component is tested and, if it passes the test, the resin is finally cured.
    Type: Application
    Filed: March 17, 2017
    Publication date: October 5, 2017
    Inventors: Christopher Andrew Bower, Ronald S. Cok, Matthew Meitl, Carl Ray Prevatte, JR.
  • Publication number: 20170256522
    Abstract: A micro-printed display includes a display substrate. An array of row conductors, an array of column conductors, and a plurality of micro-pixels are disposed on the display substrate. Each micro-pixel is uniquely connected to a row and a column conductor and comprises a pixel substrate separate from the display substrate and the pixel substrate of any other micro-pixel. Pixel conductors are patterned on each pixel substrate and one or more LEDs are disposed on or over the pixel substrate. Each LED is electrically connected to one or more of the pixel conductors and has an LED substrate separate from any other LED substrate, the display substrate, and any pixel substrate. A pixel controller disposed on the pixel substrate can control the LEDs. The micro-pixel can be electrically connected to the display substrate with connection posts. Redundant or replacement LEDs or micro-pixels can be provided on the pixel or display substrate.
    Type: Application
    Filed: March 10, 2017
    Publication date: September 7, 2017
    Inventors: Ronald S. Cok, Christopher Andrew Bower, Matthew Meitl, Carl Ray Prevatte, JR., Salvatore Bonafede, Robert R. Rotzoll