Abstract: The present invention is directed to an electronic device with an ionic wind generator assembly that provides flow of air stream inside the housing of the device. The ionic wind generator assembly with a cover assembly and a catalyst provide a mechanism for cooling heated components embedded on a PCB of the electronic device. The cover assembly is configured depending on the orientation of the ionic wind generators to increase cooling when there is a narrow gap between the PCB and the ionic wind generator assembly through which the airstream flows for cooling of the internal components.

Abstract: The present invention is a directed to an integrated ionic air mover that provides air flow rates through an opening within the a printed circuit board (PCB), or other similar insulating surface, to create the structure of the air mover, so that high heat generating components mounted on the PCB can be cooled. The ionic air mover has sharp and blunt electrodes with a corona discharge taking place in the air gap in between the electrodes. A directional emission of the ions creates an ionic wind the moves air through the PCB. The invention provides a low-cost structure, while achieving high electro-air flow power conversion efficiency and air-flow performance integrated into the PCB that the heat generating components are mounted on. The ionic air mover may also be surface mounted to a PCB and include a transmittal coil for wireless charging.