Abstract: Structures, and methods of fabrication thereof, are described wherein between an electrically conducting region and a ceramic region there is an interface region which has a thermal coefficient of expansion which is intermediate between the thermal coefficient of expansion of the conducting region and the ceramic region. This interface region substantially avoids separation of the adhesion of the conducting region from the ceramic region and avoids the creation of voids therebetween. The interface region is preferably a mixture of metal particles and ceramic material. The interface region is created by sintering alternately in oxidizing and reducing atmospheres which results in metal particles being disposed away from the metal body about the periphery or the metal body within the ceramic material.

Abstract: Structures, and methods of fabrication thereof, are described wherein between an electrically conducting region and a ceramic region there is an interface region which has a thermal coefficient of expansion which is intermediate between the thermal coefficient of expansion of the conducting region and the ceramic region. This interface region substantially avoids separation of the adhesion of the conducting region from the ceramic region and avoids the creation of voids therebetween. The interface region is preferably a mixture of metal particles and ceramic material. The interface region is created by sintering alternately in oxidizing and reducing atmospheres which results in metal particles being disposed away from the metal body about the periphery of the metal body within the ceramic material.