Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: A sensor includes a first substrate and a second substrate. The first substrate includes a first side and an opposing second side, with the first side having a recess. The recess is defined by one or more side walls and a bottom wall. One or more of the side walls are substantially perpendicular to the bottom wall. A sensing diaphragm is defined between the second side of the first substrate and the bottom wall of the recess. A boss extends from the bottom wall of the recess. The second substrate may include a first side and an opposing second side, where the first side has a recess. The first side of the first substrate may be secured to the first side of the second substrate such that the recess in the first substrate faces and is in fluid communication with the recess in the second substrate.

Abstract: A method includes forming a mask that defines a masked area and an unmasked area on a front side of a substrate, and implanting a buried layer corresponding to the unmasked area on the front side of the substrate. The method also includes forming an epitaxial layer having a back side on the front side of the substrate and on a front side of the buried layer, and creating an opening into a back side of the substrate up to a back side of the epitaxial layer and a back side of the one or portions of the buried layer.

Abstract: A sensor includes a first substrate and a second substrate. The first substrate includes a first side and an opposing second side, with the first side having a recess. The recess is defined by one or more side walls and a bottom wall. One or more of the side walls are substantially perpendicular to the bottom wall. A sensing diaphragm is defined between the second side of the first substrate and the bottom wall of the recess. A boss extends from the bottom wall of the recess. The second substrate may include a first side and an opposing second side, where the first side has a recess. The first side of the first substrate may be secured to the first side of the second substrate such that the recess in the first substrate faces and is in fluid communication with the recess in the second substrate.

Abstract: Embodiments relate generally to systems and methods for adjusting a temperature coefficient of the offset voltage (TCO) for a pressure sensor, the method comprising assembling the pressure sensor, wherein the sensor comprises a plurality of resistive elements; determining the TCO distribution for the sensor; increasing the resistance of one of a stress induced resistor or a leadout resistor of a first resistor; and decreasing the resistance of one of the stress induced resistor or the leadout resistor of the first resistor to adjust the TCO of the sensor.

Abstract: A sensor includes a first substrate and a second substrate. The first substrate includes a first side and an opposing second side, with the first side having a recess. The recess is defined by one or more side walls and a bottom wall. One or more of the side walls are substantially perpendicular to the bottom wall. A sensing diaphragm is defined between the second side of the first substrate and the bottom wall of the recess. A boss extends from the bottom wall of the recess. The second substrate may include a first side and an opposing second side, where the first side has a recess. The first side of the first substrate may be secured to the first side of the second substrate such that the recess in the first substrate faces and is in fluid communication with the recess in the second substrate.

Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: According to the various embodiments of the present disclosure, footwear with an enhanced toe post is provided. In an exemplary embodiment, the footwear may comprise a sole portion to support and protect a wearer's foot, a strap portion attached to the sole to bind the footwear to a wearer's foot, and at least one toe post passing between a wearer's toes constructed at least partially of memory foam or other cushioning materials.

Abstract: Embodiments relate generally to systems and methods for adjusting a temperature coefficient of the offset voltage (TCO) for a pressure sensor, the method comprising assembling the pressure sensor, wherein the sensor comprises a plurality of resistive elements; determining the TCO distribution for the sensor; increasing the resistance of one of a stress induced resistor or a leadout resistor of a first resistor; and decreasing the resistance of one of the stress induced resistor or the leadout resistor of the first resistor to adjust the TCO of the sensor.

Abstract: A sensor includes a first substrate and a second substrate. The first substrate includes a first side and an opposing second side, with the first side having a recess. The recess is defined by one or more side walls and a bottom wall. One or more of the side walls are substantially perpendicular to the bottom wall. A sensing diaphragm is defined between the second side of the first substrate and the bottom wall of the recess. A boss extends from the bottom wall of the recess. The second substrate may include a first side and an opposing second side, where the first side has a recess. The first side of the first substrate may be secured to the first side of the second substrate such that the recess in the first substrate faces and is in fluid communication with the recess in the second substrate.

Abstract: A humidity sensor may include a first substrate having a recess formed in a first side, a second substrate and an insulating layer supported by the second substrate. The second substrate and the insulating layer may be supported by the first side of the first substrate and extend over the recess to form a diaphragm with the insulating layer facing the recess. The diaphragm may be at least partially thermally isolated from a remainder of the second substrate. A resistive heater element may be supported by the diaphragm. A pair of sensing electrodes are electrically separated from each other and supported by the diaphragm. A sensing material is disposed over the pair of sensing electrodes, wherein an electrical property of the sensing material changes in response to a change in moisture content of the sensing material.

Abstract: A pressure sensor includes a pressure sensing element and a top cap. The pressure sensing element includes a bonded wafer substrate having a buried sealed cavity. A wall of the buried sealed cavity forms a sensing diaphragm. One or more sense elements may be supported by the sensing diaphragm and one or more bond pads are supported by the upper side of the bonded wafer substrate. Each of the bond pads may be positioned adjacent to the sensing diaphragm and electrically connected to one or more of the sense elements. The top cap may be secured to the upper side of the bonded wafer substrate such that an aperture in the top cap facilitates passage of a media in a downward direction to the sensing diaphragm. The top cap may be configured to isolate the bond pads from the media.

Abstract: A method includes forming a mask that defines a masked area and an unmasked area on a front side of a substrate, and implanting a buried layer corresponding to the unmasked area on the front side of the substrate. The method also includes forming an epitaxial layer having a back side on the front side of the substrate and on a front side of the buried layer, and creating an opening into a back side of the substrate up to a back side of the epitaxial layer and a back side of the one or portions of the buried layer.

Abstract: A humidity sensor may include a first substrate having a recess formed in a first side, a second substrate and an insulating layer supported by the second substrate. The second substrate and the insulating layer may be supported by the first side of the first substrate and extend over the recess to form a diaphragm with the insulating layer facing the recess. The diaphragm may be at least partially thermally isolated from a remainder of the second substrate. A resistive heater element may be supported by the diaphragm. A pair of sensing electrodes are electrically separated from each other and supported by the diaphragm. A sensing material is disposed over the pair of sensing electrodes, wherein an electrical property of the sensing material changes in response to a change in moisture content of the sensing material.

Abstract: A pressure sensor having a diaphragm having a boss with a pattern. The diaphragm having a boss may be regarded as a bossed diaphragm. The bossed diaphragm may have higher sensitivity than a flat plate diaphragm having the same area as the bossed diaphragm. The bossed diaphragm may incorporate a simple cross pattern that can further improve the sensitivity and linearity of a pressure response of the diaphragm at low pressures. Reduction of sharp edges and corners of the boss and its legs around the periphery of the diaphragm may reduce high stress points and thus increase the burst pressure rating of the bossed diaphragm.

Abstract: A sensor assembly includes a first wafer having a cavity formed therein and a second wafer bonded relative to the first wafer to form a diaphragm over the cavity. A trench is formed in the second wafer in or around the diaphragm and the trench may be filled with an isolating material to help thermally and/or electrically isolate the diaphragm. The diaphragm may support one or more sense elements. The sensor assembly may be used a flow sensor, a pressure sensor, a temperature sensor, and/or any other suitable sensor, as desired.

Abstract: A pressure sensor having a diaphragm having a boss with a pattern. The diaphragm having a boss may be regarded as a bossed diaphragm. The bossed diaphragm may have higher sensitivity than a flat plate diaphragm having the same area as the bossed diaphragm. The bossed diaphragm may incorporate a simple cross pattern that can further improve the sensitivity and linearity of a pressure response of the diaphragm at low pressures. Reduction of sharp edges and corners of the boss and its legs around the periphery of the diaphragm may reduce high stress points and thus increase the burst pressure rating of the bossed diaphragm.