Abstract: A solder ball dispenser (100) has feeder unit, head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are mobilized in the chambers by moving air. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The singulator ejects the balls one at a time to a target device such as a Ball Grid Array. The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum. The trajectory of each solder ball is stopped before moving to a next position in the pneumatic singulator. No solid object causes solder balls to move within the dispenser or to be ejected from the dispenser.

Abstract: An extendable arm for placing and moving items includes a base and an arm unit movably mounted to the base. The arm unit is configured for linear movement in a first direction relative to the arm unit for extending beyond the base in the first direction and for linear movement in a second direction relative to the arm unit which is opposite to the first direction for extending beyond the base in the second direction.

Abstract: A solder ball dispenser (100) has feeder unit and head unit chambers (200, 300) and a pneumatic singulator (370). Solder balls (101) are put into motion in the chambers by moving air. The pneumatic singulator and a channel for solder balls are formed, machined or molded in a head plate (142) of a dispenser and enclosed by a front plate (141) and a back plate (143) secured adjacent to the head plate. The solder ball dispenser receives a continuous supply of unorganized solder balls and arranges them in a single stack (340). The pneumatic singulator ejects the balls one at a time to a target device such as a Ball Grid Array (BGA). The dispenser has a plurality of conduits (331-338) for applying one of air pressure and vacuum to various points of the chambers and the channel. Solder balls are transported through the dispenser and ejected from the dispenser by the programmed application of air pressure and vacuum.

Abstract: A solder ball placement system incorporating a placement head moveable vertically toward and away from a solder ball shuttle having a plurality of solder balls positioned thereon. A corresponding plurality of pickup tubes extend from the placement head and are connected to a vacuum source for attracting and holding a corresponding solder ball. The pickup tubes are mounted for limited vertical movement with respect to the placement head to allow the individual pickup tubes to extend into the placement head varying distances to accommodate for uneven placement of solder balls such as warpage of a workpiece or shuttle. The respective pickup tubes each incorporate a collar abutting against a vibrator plate that is actuated by an ejector solenoid when the vacuum is released and the solder balls are to be placed on a workpiece.