Abstract: Described herein are various embodiments of a valve that may be opened and closed using a thixotropic or “stress yield” material, or other material that temporarily changes phase upon application of energy to the material. More particularly, some embodiments may include a valve that is opened and closed using a granular gel that is a temporary phase change material.

Abstract: Provided herein are high energy ion beam generator systems and methods that provide low cost, high performance, robust, consistent, uniform, low gas consumption and high current/high-moderate voltage generation of neutrons and protons. Such systems and methods find use for the commercial-scale generation of neutrons and protons for a wide variety of research, medical, security, and industrial processes.

Abstract: The disclosure describes artificial reality systems and techniques for saving and exporting artificial reality data. For example, an artificial reality system includes an application engine configured to generate artificial reality content based on a pose of a user participating in an artificial reality environment and a head-mounted display (HMD) configured to output the artificial reality content to the user. The HMD includes a buffer configured to hold data representative of the artificial reality environment during a time window on a rolling basis and a capture engine configured to, in response to user input, capture the data representative of the artificial reality environment held in the buffer at a point in time at which the user input was received.

Abstract: The disclosed computer-implemented method may include generating a table for a plurality of encodings of media files stored in at least one data center, the generating including determining a benefit to cost ratio for each encoding listed in the table based on one or more criteria associated with the respective encoding, and assigning a priority to each of the encodings in the table based on the benefit to cost ratio, determining whether a soft quota for an amount of memory for storage of the media files has been exceeded, and in response to determining that a soft quota for an amount of memory for storage of the media files has been exceeded, performing a data storage reduction process based on the priority associated with each of the encodings in the table. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A storage rack having an embedded display may include a plurality of sections for holding a respective plurality of items. A first section may include, for example, a first vertical support, a second vertical support substantially parallel to the first vertical support, and a first set of horizontal supports substantially perpendicular to the first vertical support and the second vertical support. The first set of horizontal supports may include a first horizontal support disposed at a first height and a first depth in the first vertical support, and a second horizontal support disposed at the first height and the first depth in the second vertical support. The first horizontal support may extend from an inner wall of the first vertical support towards the second vertical support for a distance that is less than half of the distance between the first vertical support and the second vertical support.

Abstract: An IC that includes a contiguous standard cell area with a 4x3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: A storage rack having an embedded display may include a plurality of sections for holding a respective plurality of items. A first section may include, for example, a first vertical support, a second vertical support substantially parallel to the first vertical support, and a first set of horizontal supports substantially perpendicular to the first vertical support and the second vertical support. The first set of horizontal supports may include a first horizontal support disposed at a first height and a first depth in the first vertical support, and a second horizontal support disposed at the first height and the first depth in the second vertical support. The first horizontal support may extend from an inner wall of the first vertical support towards the second vertical support for a distance that is less than half of the distance between the first vertical support and the second vertical support.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: A method of resilvering a plurality of failed devices in storage pools includes detecting a failure of a first storage device in a storage pool, identifying data blocks that were stored on the first storage device that are also stored on other storage devices, and resilvering the first storage device by transferring the data blocks from the other storage devices. While resilvering the first storage device, the method includes detecting a failure of a second storage device in the storage pool, identifying a subset of the data blocks that were stored on the first storage device that were also stored on the second storage device, and reusing a set of sequential I/O commands to resilver at least a portion of the second storage device with the subset of the data blocks.

Abstract: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas.

Abstract: A method of resilvering a plurality of failed devices in storage pools includes detecting a failure of a first storage device in a storage pool, identifying data blocks that were stored on the first storage device that are also stored on other storage devices, and resilvering the first storage device by transferring the data blocks from the other storage devices. While resilvering the first storage device, the method includes detecting a failure of a second storage device in the storage pool, identifying a subset of the data blocks that were stored on the first storage device that were also stored on the second storage device, and reusing a set of sequential I/O commands to resilver at least a portion of the second storage device with the subset of the data blocks.

Abstract: An IC includes a contiguous standard cell area with first, second, and third TS-GATE-short-configured test area geometries disposed therein. In some embodiments, the contiguous standard cell area may further include: fourth and fifth TS-GATE-short-configured test area geometries, and/or other test area geometries, such as tip-to-tip-short, tip-to-side-short, diagonal-short, corner-short, interlayer-overlap-short, via-chamfer-short, merged-via-short, snake-open, stitch-open, via-open, or metal-island-open.

Abstract: A method of reconstructing data from a failed storage device in a storage pool includes identifying a plurality of data blocks that are stored on the failed storage device, and sorting the plurality of data blocks in an order in which the plurality of data blocks are located on the failed storage device. Each of the plurality of data blocks may be associated with an I/O operation. The method may also include grouping the I/O operations for the plurality of data blocks into sequential I/O operations based on the order in which the plurality of data blocks are located on the failed storage device, and executing the sequential I/O operations to resilver a new storage device replacing the failed storage device.

Abstract: A method of resilvering a plurality of failed devices in a storage pool may include detecting a failure of a first storage device in the storage pool, and determining a plurality of data blocks that are stored on the first storage device. The method may also include sorting the plurality of data blocks into one or more buckets in an order in which the plurality of data blocks are located on the first storage device, and detecting a failure of a second storage device in the storage pool after detecting the failure of the first storage device. The method may further include determining that one or more of the plurality of data blocks are also located on the second storage device, and reusing at least part of the one or more buckets to resilver the second storage device.

Abstract: Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such processes may involve evaluating Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).

Abstract: A method for processing a semiconductor wafer uses non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with a moving stage and beam deflection to account for motion of the stage.