Abstract: A plasma system is disclosed. The system includes: a plasma device including at least one electrode; an ionizable media source coupled to the plasma device and configured to supply ionizable media thereto; a precursor source configured to supply at least one precursor feedstock to the plasma device, wherein the at least one precursor feedstock includes at least one catalyst material; and a power source coupled to the inner and outer electrodes and configured to ignite the ionizable media and the at least one precursor feedstock at the plasma device to form a plasma effluent.

Abstract: A system and method for convectively heating tissue to smooth the surface of the tissue. A fluid, such as saline is distributed across a tissue surface. A bipolar tool is placed within the fluid, but not touching the tissue. An RF signal is sent from a generator through the electrodes to rapidly boil the fluid. Heat is then transferred from the boiling fluid to the tissue resulting in minimal heat damage to tissue. An impedance matching system is used to maximize power received at the bipolar from the generator. Additionally, a control system monitors the boiling fluid to limit arcing.

Abstract: A plasma processing system is provided with diagnostic apparatus for making in-situ measurements of plasma properties. The diagnostic apparatus generally comprises a non-invasive sensor array disposed within a plasma processing chamber, an electrical circuit for stimulating the sensors, and means for recording and communicating sensor measurements for monitoring or control of the plasma process. In one form, the sensors are dynamically pulsed dual floating Langmuir probes that measure incident charged particle currents and electron temperatures in proximity to the plasma boundary or boundaries within the processing system. The plasma measurements may be used to monitor the condition of the processing plasma or furnished to a process system controller for use in controlling the plasma process.

Abstract: A system and method for convectively heating tissue to smooth the surface of the tissue. A fluid, such as saline is distributed across a tissue surface. A bipolar tool is placed within the fluid, but not touching the tissue. An RF signal is sent from a generator through the electrodes to rapidly boil the fluid. Heat is then transferred from the boiling fluid to the tissue resulting in minimal heat damage to tissue. An impedance matching system is used to maximize power received at the bipolar from the generator. Additionally, a control system monitors the boiling fluid to limit arcing.

Abstract: A plasma processing system is provided with diagnostic apparatus for making in-situ measurements of plasma properties. The diagnostic apparatus generally comprises a non-invasive sensor array disposed within a plasma processing chamber, an electrical circuit for stimulating the sensors, and means for recording and communicating sensor measurements for monitoring or control of the plasma process. In one form, the sensors are dynamically pulsed dual floating Langmuir probes that measure incident charged particle currents and electron temperatures in proximity to the plasma boundary or boundaries within the processing system. The plasma measurements may be used to monitor the condition of the processing plasma or furnished to a process system controller for use in controlling the plasma process.

Abstract: An electrode assembly for a plasma reactor used in connection with fabrication or manufacture of semiconductor devices. The electrode assembly includes an anode having, a top side that includes a pedestal adapted to support a wafer and defines an annular void that preferably surrounds the pedestal and extends to an outer periphery of the top side. The electrode assembly also includes a ring removably received within the annular void so that the ring extends from the pedestal and covers substantially the entire portion of the top side of the anode save the pedestal. The thickness of the ring is slightly less than the height of the pedestal so that the top surface of the ring is located below the top surface of the pedestal. When the wafer is supported by the pedestal during fabrication of a semiconductor device, the wafer extends beyond the circumference of the pedestal, and a gap is defined between the wafer and the removable ring. The removable ring can be quickly and easily removed and replaced.

Abstract: A sloped via through polyimide between metal layers is achieved by first sloping a hard mask which overlies the polyimide. Sloped photoresist overlying the hard mask transfers the slope to the hard mask. The sloped hard mask is used to slope the polyimide. Oxide underlying the polyimide is also etched to expose the metal. The underlying oxide layer can be subsequently slope etched.