Patents by Inventor Carl Wood
Carl Wood has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080271992Abstract: An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.Type: ApplicationFiled: June 30, 2004Publication date: November 6, 2008Applicant: Lam Research Corp.Inventors: Yezdi N. Dordi, Fred C. Redeker, John M. Boyd, Robert Maraschin, Carl Woods
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Patent number: 7406972Abstract: An apparatus for generating a fluid meniscus to process a substrate is provided. The apparatus includes a manifold head with a manifold surface having a plurality of conduits configured to generate a fluid meniscus on a substrate surface when positioned proximate the substrate. The manifold head has a plurality of passages capable of communicating fluids with the plurality of conduits. The apparatus also includes an interface membrane attached to a portion of the manifold head. The interface membrane is configured to block a portion of the plurality of conduits during operation.Type: GrantFiled: September 21, 2007Date of Patent: August 5, 2008Assignee: Lam Research CorporationInventors: Carl Woods, Michael G. R. Smith, John Parks
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Patent number: 7395611Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.Type: GrantFiled: September 21, 2006Date of Patent: July 8, 2008Assignee: Lam Research CorporationInventors: James P. Garcia, John M. de Larios, Michael Ravkin, Fred C. Redeker, Carl Woods
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Patent number: 7389783Abstract: An apparatus for processing a substrate is provided which includes a first manifold module to generate a fluid meniscus on a substrate surface. The apparatus also includes a second manifold module to connect with the first manifold module and also to move the first manifold module into close proximity to the substrate surface to generate the fluid meniscus.Type: GrantFiled: April 1, 2004Date of Patent: June 24, 2008Assignee: Lam Research CorporationInventors: Carl Woods, Michael G. R. Smith, John Parks, James P. Garcia, John M. de Larios
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Patent number: 7387689Abstract: Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.Type: GrantFiled: May 18, 2007Date of Patent: June 17, 2008Assignee: Lam Research CorporationInventors: John M. de Larios, Mike Ravkin, Carl Woods, Fritz Redeker, James P. Garcia
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Patent number: 7383844Abstract: A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.Type: GrantFiled: October 3, 2006Date of Patent: June 10, 2008Assignee: Lam Research CorporationInventors: Carl Woods, James P. Garcia, John de Larios
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Patent number: 7350316Abstract: A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head is also provided, and is configured as a bar shape that extends approximately the diameter of the wafer, and the second head is configured for placement on a second side of the substrate, such that the second side is opposite the first side. In this example, each of the first head and the second head have conduits formed therein along the diameter of the substrate for delivering and removing fluids so that a meniscus is capable of being contained between each of the first head and a substrate surface of the first side of the substrate and the second head and a substrate surface of the second side of the substrate.Type: GrantFiled: January 3, 2007Date of Patent: April 1, 2008Assignee: Lam Research CorporationInventors: Carl Woods, James P. Garcia, John de Larios
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Patent number: 7350315Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.Type: GrantFiled: December 22, 2003Date of Patent: April 1, 2008Assignee: Lam Research CorporationInventors: Glenn W. Davis, Carl Woods, John Parks, Fred C. Redeker, Mike Ravkin, Michael L. Orbock
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Publication number: 20080006307Abstract: An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.Type: ApplicationFiled: September 21, 2007Publication date: January 10, 2008Applicant: Lam Research Corp.Inventors: Carl Woods, Michael Smith, John Parks
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Publication number: 20070278435Abstract: An apparatus and a method of substantially sealing a throughbore of a tubular with a line running therethrough. The method comprises the steps of: (a) substantially enclosing the line and sealing a portion of the throughbore around the line using an enclosing means; (b) injecting a fluid that contains solid particles in the region of the line; and (c) substantially sealing a remaining portion of the throughbore using the solid particles such that the sealed throughbore is capable of withstanding a pressure differential. The method can include settling out the solid particles from the fluid in response to a drop in pressure of the fluid during step (b). The method can include injecting a first fluid in the region of the line prior to step (b). The first fluid can be a heavy hydrocarbon such as a grease and the fluid containing solid particles can be a drilling fluid.Type: ApplicationFiled: June 1, 2007Publication date: December 6, 2007Inventor: Carl Wood
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Patent number: 7293571Abstract: An apparatus for generating a fluid meniscus to be formed on a surface of a substrate is provided including a housing where the housing includes a housing surface to be placed proximate to a substrate surface of the substrate. The housing further includes a process configuration receiving region that is surrounded by the housing surface. The apparatus also includes a process configuration insert which has an insert surface where the process configuration insert is defined to fit within the process configuration receiving region of the housing such that the insert surface and the housing surface define a proximity face that can be placed proximate to the substrate surface of the substrate.Type: GrantFiled: April 1, 2004Date of Patent: November 13, 2007Assignee: Lam Research CorporationInventors: Carl Woods, Michael G. R. Smith, John Parks
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Publication number: 20070235409Abstract: Method for processing a substrate are provided. The processing occurs when the substrate is moved between cluster tools. One method includes providing the substrate to a cluster tool, and the cluster tool is configured to move the substrate into a meniscus processing module having at least one proximity head. The proximity head is configured to perform operations including applying a fluid onto a region of a surface of the substrate, such the fluid is continuously flown so as to substantially fill the region between a surface of the proximity head and the surface of the substrate. An operation of removing the fluid from the region by applying a vacuum force through the proximity head is also provided. The applying and removing is operated substantially simultaneously so that the fluid forms a controlled fluid meniscus that remains between the surface of the substrate and the surface of the proximity head when the proximity head is positioned over the substrate.Type: ApplicationFiled: May 31, 2007Publication date: October 11, 2007Applicant: Lam Research Corp.Inventors: Carl Woods, John de Larios
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Publication number: 20070218653Abstract: Methods for processing substrate through a head that is configured to be placed in close non-contact proximity to a surface of a substrate are provided. One method includes applying a first fluid onto the surface of the substrate from conduits in the head when the head is in close proximity to the surface of the substrate and removing the first fluid from the surface of the substrate. The removing is processed just as first fluid is applied to the surface of the substrate, and the removing ensures that the applied first fluid is contained between a surface of the head and the surface of the substrate and the first fluid being applied and removed defines a controlled meniscus. The method further includes moving the controlled meniscus over different regions of the surface of the substrate when movement of the head or the substrate is dictated. The moving of the controlled meniscus enables processing of part or all of the surface of the substrate using the first fluid.Type: ApplicationFiled: May 18, 2007Publication date: September 20, 2007Inventors: John de Larios, Mike Ravkin, Carl Woods, Fritz Redeker, James Garcia
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Patent number: 7240679Abstract: One of many embodiments of a substrate preparation system is provided which includes a drying system, the drying system including at least one proximity head for drying a substrate. The system also includes a cleaning system for cleaning the substrate.Type: GrantFiled: December 24, 2002Date of Patent: July 10, 2007Assignee: Lam Research CorporationInventors: Carl Woods, John de Larios
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Patent number: 7234477Abstract: One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.Type: GrantFiled: September 30, 2002Date of Patent: June 26, 2007Assignee: Lam Research CorporationInventors: John M. de Larios, Mike Ravkin, Carl Woods, Fritz Redeker, James P. Garcia, Afshin Nickhou
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Publication number: 20070107756Abstract: A system and apparatus for cleaning a substrate is provided. The system includes a first head configured as a bar shape that extends approximately a diameter of the substrate. The first head is configured for placement on a first side of the substrate. A second head is also provided, and is configured as a bar shape that extends approximately the diameter of the wafer, and the second head is configured for placement on a second side of the substrate, such that the second side is opposite the first side. In this example, each of the first head and the second head have conduits formed therein along the diameter of the substrate for delivering and removing fluids so that a meniscus is capable of being contained between each of the first head and a substrate surface of the first side of the substrate and the second head and a substrate surface of the second side of the substrate.Type: ApplicationFiled: January 3, 2007Publication date: May 17, 2007Inventors: Carl Woods, James Garcia, John de Larios
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Patent number: 7198055Abstract: A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.Type: GrantFiled: December 24, 2002Date of Patent: April 3, 2007Assignee: Lam Research CorporationInventors: Carl Woods, James P. Garcia, John de Larios
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Patent number: 7192488Abstract: A system and method for processing an edge of a substrate includes an edge roller and a first proximity head. The first proximity head being mounted on the edge roller. The first proximity head capable of forming a meniscus and including a concave portion and multiple ports opening into the concave portion. The concave portion being capable of receiving an edge of a substrate and the ports including at least one process liquid injection port, at least one vacuum port and at least one surface tension control port.Type: GrantFiled: December 1, 2005Date of Patent: March 20, 2007Assignee: Lam Research CorporationInventors: Carl A. Woods, James P. Garcia, John M. de Larios
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Publication number: 20070023070Abstract: A head is provided which includes a first surface of the head capable of being in close proximity to the wafer surface, and includes a first conduit region on the head where the first conduit region is defined for delivery of a first fluid to wafer of the surface and the first conduit region is defined in a center portion of the head. The head further includes a second conduit region on the head which surrounds the first conduit region, and includes a third conduit region on the head which is defined for delivery of a second fluid to the wafer surface. The third conduit region semi-encloses the first conduit region and the second conduit region. The second conduit region enables a removal of the first fluid and the second fluid. The delivery of the first fluid and the second fluid combined with the removal by the third conduit region of the head defines a controllable meniscus.Type: ApplicationFiled: October 3, 2006Publication date: February 1, 2007Applicant: Lam Research Corp.Inventors: Carl Woods, James Garcia, John de Larios
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Publication number: 20070011905Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.Type: ApplicationFiled: September 21, 2006Publication date: January 18, 2007Applicant: LAM RESEARCH CORPORATIONInventors: James Garcia, John de Larios, Michael Ravkin, Fred Redeker, Carl Woods