Abstract: A connection assembly for a well comprises first and second tubular, one of which is adapted to connect to the well, the first tubular having a bore adapted to receive the second tubular. The first and second tubulars lock together, and have first and second seals compressed between an outer surface of the second tubular and an inner surface of the first tubular to create a fluid chamber. The second seal is axially and radially spaced from the first seal. A hydraulic pressure system is adapted to drive hydraulic fluid into the fluid chamber to urge the second tubular out of the first tubular when the first and second seals are compressed between the first and second tubulars. A method of making connections is also disclosed.

Abstract: A connection assembly for a well comprises first and second tubular, one of which is adapted to connect to the well, the first tubular having a bore adapted to receive the second tubular. The first and second tubulars lock together, and have first and second seals compressed between an outer surface of the second tubular and an inner surface of the first tubular to create a fluid chamber. The second seal is axially and radially spaced from the first seal. A hydraulic pressure system is adapted to drive hydraulic fluid into the fluid chamber to urge the second tubular out of the first tubular when the first and second seals are compressed between the first and second tubulars. A method of making connections is also disclosed.

Abstract: Embodiments disclosed herein relate to polycrystalline diamond compacts (“PDCs”) including at least one mechanically-stressed polycrystalline diamond (“PCD”) table having an upper surface that exhibits a compressive stress state. Providing a selected support structure to the mechanically-stressed PCD table and/or generating a favorable stress state in the upper surface of the mechanically-stressed PCD table may improve a toughness and/or a strength of the mechanically-stressed PCD table and the PDC. In an embodiment, a PDC includes a substrate including an interfacial surface and a preformed PCD table attached to the substrate. The preformed PCD table includes an upper surface spaced from a bottom surface that faces the interfacial surface of the substrate. In such an embodiment, the upper surface of the preformed PCD table exhibits a mechanical deflection and a concave curvature induced by deflecting the preformed PCD table toward the substrate.

Abstract: A roller device for incorporation into a wireline tool string for use in an oil or gas well has a body with rollers comprising captive bearings arranged on the outer surface of the body to rotate around more than one axis relative to the body, and wherein the rollers are arranged in at least one or more helix around the body. Each helix completes at least one full circumferential turn around the body. The rollers circumferentially overlap one another on the body, so that when the body engages the inner wall of the wellbore, the entire circumference of the body is supported by at least one roller.

Abstract: A wireline pressure control apparatus for use in an oil or gas well, comprising a grease injector having first and second tubes (10) and a bore (12), and a grease injection channel in communication with the bore for injecting grease between the outer surface of the wireline and the inner surface of the bore. The bore (12) has radial passages (15) at spaced apart locations providing a leak path for fluids between the inner surface of the bore and the outer surface of the tubes, allowing pressure to equalize. The radial passages are in fluid communication with one another outwith the bore.

Abstract: A roller device for incorporation into a wireline tool string for use in an oil or gas well has a body with rollers comprising captive bearings arranged on the outer surface of the body to rotate around more than one axis relative to the body, and wherein the rollers are arranged in at least one or more helix around the body. Each helix completes at least one full circumferential turn around the body. The rollers circumferentially overlap one another on the body, so that when the body engages the inner wall of the wellbore, the entire circumference of the body is supported by at least one roller.

Abstract: A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment.

Abstract: A wireline pressure control apparatus for use in an oil or gas well, comprising a grease injector having first and second tubes (10) and a bore (12), and a grease injection channel in communication with the bore for injecting grease between the outer surface of the wireline and the inner surface of the bore. The bore (12) has radial passages (15) at spaced apart locations providing a leak path for fluids between the inner surface of the bore and the outer surface of the tubes, allowing pressure to equalise. The radial passages are in fluid communication with one another outwith the bore.

Abstract: A system for cleaning a substrate includes a carrier and a cleaning station. The carrier is capable of holding the substrate and is movably coupled to a pair of guide tracks extending a length of the system. The cleaning station includes a force applicator, a gate and a dispenser. The force applicator has an applicator length and is coupled to the cleaning station, is rotatable and is adjustable to a first height off the surface of the carrier during cleaning. The gate is a hollow structure disposed at a trailing edge of the force applicator. The gate is set to a height off the carrier surface that is less than or equal to the first height. The gate includes a gate length that at least spans the applicator length. The dispenser is disposed at a leading edge of the force applicator and is configured to supply cleaning solution during cleaning.

Abstract: A system for cleaning a substrate includes a carrier and a cleaning station. The carrier is capable of holding the substrate and is movably coupled to a pair of guide tracks extending a length of the system. The cleaning station includes a force applicator and a gate. The force applicator has an applicator length and is operatively coupled to the cleaning station. The force applicator is rotatable and is adjusted to a first height off the surface of the carrier as the substrate is being cleaned. The force applicator has a hollow structure with internal channels and openings dispersed throughout the applicator length to dispense cleaning solution to substrate surface. The gate is affixed to a trailing edge of the force applicator and is set to a second height off the surface of the carrier. The gate includes a gate length that at least spans the applicator length.

Abstract: A system for cleaning a substrate includes a carrier and a cleaning station. The carrier is capable of holding the substrate and is movably coupled to a pair of guide tracks extending a length of the system. The cleaning station includes a force applicator and a gate. The force applicator has an applicator length and is operatively coupled to the cleaning station. The force applicator is rotatable and is adjusted to a first height off the surface of the carrier as the substrate is being cleaned. The force applicator has a hollow structure with internal channels and openings dispersed throughout the applicator length to dispense cleaning solution to substrate surface. The gate is affixed to a trailing edge of the force applicator and is set to a second height off the surface of the carrier. The gate includes a gate length that at least spans the applicator length.

Abstract: An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.

Abstract: A method for preparing a surface of a substrate is provided. The method includes scanning the surface of the substrate by a meniscus, preparing the surface of the substrate using the meniscus, and performing a next preparation operation on the surface of the substrate that was prepared without performing a rinsing operation.

Abstract: First and second electrodes are disposed at first and second locations, respectively, proximate to a periphery of a wafer support, wherein the first and second location are substantially opposed to each other relative to the wafer support. Each of the first and second electrodes can be moved to electrically connect with and disconnect from a wafer held by the wafer support. An anode is disposed over and proximate to the wafer such that a meniscus of electroplating solution is maintained between the anode and the wafer. As the anode moves over the wafer from the first location to the second location, an electric current is applied through the meniscus between the anode and the wafer. Also, as the anode is moved over the wafer, the first and second electrodes are controlled to connect with the wafer while ensuring that the anode does not pass over an electrode that is connected.

Abstract: An actuator or valve includes an inner member; an outer member around the normally rotatable inner member; the inner member including normally two spaced apart outwardly extending projections abutting with the outer member; the outer member including normally two inwardly extending projections abutting with the inner member, the projections defining a chamber therebetween; and the actuator further including a fluid port in communication with the chamber. The actuator/valve is normally made by straight profile cutting. The compact rotary actuator may be remotely operated.

Abstract: An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height to off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.

Abstract: An apparatus used to supply a force onto a cleaning solution for processing a substrate for cleaning surface contaminants is disclosed. The apparatus includes a force applicator and a gate. The force applicator is configured to be adjusted to a first height off the surface of the substrate. The gate is positioned adjacent to a trailing point of the force applicator and is configured to be adjusted to a second height off of the surface of the substrate to enable planarization of the cleaning solution as the solution moves to the trailing point.

Abstract: An electroplating apparatus for electroplating a surface of a wafer is provided. The wafer is capable of being electrically charged as a cathode. The electroplating apparatus includes a plating head capable of being positioned either over or under the surface of a wafer and capable of being electrically charged as an anode. The plating head is capable of enabling metallic plating between the surface of the wafer and the plating head when the wafer and plating head are charged. The plating head further comprises a voltage sensor pair capable of sensing a voltage present between the plating head and the surface of the wafer, and a controller capable of receiving data from the voltage sensor pair. The data received from the voltage sensor pair is used by the controller to maintain a substantially constant voltage to be applied by the anode when the plating head is placed in positions over the surface of the wafer. A method of electroplating a wafer is also provided.

Abstract: A multi-layered wafer support apparatus is provided for performing an electroplating process on a semiconductor wafer (“wafer”). The multi-layered wafer support apparatus includes a bottom film layer and a top film layer. The bottom film layer includes a wafer placement area and a sacrificial anode surrounding the wafer placement area. The top film layer is defined to be placed over the bottom film layer. The top film layer includes an open region to be positioned over a surface of the wafer to be processed, i.e., electroplated. The top film layer provides a liquid seal between the top film layer and the wafer, about a periphery of the open region. The top film layer further includes first and second electrical circuits that are each defined to electrically contact a peripheral top surface of the wafer at diametrically opposed locations about the wafer.

Abstract: An apparatus for processing a substrate is provided. The apparatus includes a plating head configured to plate a surface of the substrate with a layer of a material using a fluid meniscus between the plating head and a surface of the substrate. The apparatus also includes a fluid meniscus stabilizing apparatus configured to apply a pre-processing fluid to the surface of the substrate before the fluid meniscus is applied to the surface.