Abstract: A method for coating select portions of a liquid jetting assembly with a hydrophobic coating comprises the steps of establishing a first pressure inside of an ink chamber of the jetting assembly; establishing a second pressure outside of the ink chamber of the jetting assembly, the inside and the outside being fluidly communicable with one another by an ink delivery channel; and introducing a composition capable of forming a hydrophobic coating outside of the ink chamber. The second pressure can facilitate formation of the hydrophobic coating on an outer surface of the liquid jetting assembly, and the first pressure can restrict the hydrophobic coating from being formed within the ink chamber.

Abstract: A fluid delivery system includes a plurality of nozzles having an outer surface and a bore. A hydrophobic layer is applied to a portion of the outer surface of the nozzle and extends into the nozzle bore a determined distance.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: A process for creating and an apparatus employing shaped orifices in a semiconductor substrate. A first layer of material is applied on the semiconductor substrate then a second layer of material is then applied upon the first layer of material. An orifice image is then transferred to the first layer of material and a fluid-well image is transferred to the second layer of material. That portion of the second layer of material where the orifice image is located is then developed along with that portion of the first layer of material where the fluid well is located to define an orifice in the substrate.

Abstract: The present invention relates to DNA sequence coding for part or all of the heat shock transcription factor or heat shock factor (HSF) proteins derived from humans and Drosophila, and the proteins encoded by these sequences.The present invention also includes methods for detecting HSF in a biological sample. The presence of HSF in the nucleus of a cell can be detected with specific anti-HSF antibody reagents. The presence of such HSF proteins in the nucleus indicates a stressed condition including diseases. Furthermore, the presence of multimeric HSF in the crude or fractionated cell extract is indicative of a stressed state.