Patents by Inventor Carlaton WONG
Carlaton WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12278089Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.Type: GrantFiled: January 31, 2023Date of Patent: April 15, 2025Assignee: Applied Materials, Inc.Inventors: Michael Andrew Stearns, Kartik Ramaswamy, Carlaton Wong
-
Patent number: 12211734Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.Type: GrantFiled: March 7, 2022Date of Patent: January 28, 2025Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Sulyman, Carlaton Wong, Rajinder Dhindsa, Timothy Joseph Franklin, Steven Babayan, Anwar Husain, James Hugh Rogers, Xue Yang Chang
-
Patent number: 12068137Abstract: A component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.Type: GrantFiled: September 25, 2020Date of Patent: August 20, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Reyn Tetsuro Wakabayashi, Carlaton Wong, Timothy Joseph Franklin
-
Publication number: 20240266152Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. The first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. The power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.Type: ApplicationFiled: February 8, 2023Publication date: August 8, 2024Inventors: Michael Andrew STEARNS, Alok RANJAN, Kartik RAMASWAMY, Peng TIAN, Timothy Joseph FRANKLIN, Chris BLANK, Carlaton WONG
-
Publication number: 20240258070Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.Type: ApplicationFiled: January 31, 2023Publication date: August 1, 2024Inventors: Michael Andrew STEARNS, Kartik RAMASWAMY, Carlaton WONG
-
Patent number: 12020977Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.Type: GrantFiled: March 7, 2022Date of Patent: June 25, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Alexander Sulyman, Anwar Husain, Timothy Joseph Franklin, Carlaton Wong, Xue Yang Chang
-
Publication number: 20230343552Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.Type: ApplicationFiled: June 28, 2023Publication date: October 26, 2023Applicant: Applied Materials, Inc.Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
-
Publication number: 20230323531Abstract: A method includes affixing a supply apparatus to inlets for one or more channels of a chamber component. The channels provide one or more gas flow paths between a first side of the chamber component that comprises the inlets and a second side of the chamber component comprising outlets of the one or more channels. The method further includes affixing an exhaust apparatus to the outlets of the one or more channels. The method further includes performing a plurality of atomic layer deposition cycles to deposit a corrosion resistant coating on interior surfaces of the one or more channels of the chamber component.Type: ApplicationFiled: December 27, 2022Publication date: October 12, 2023Inventors: Joseph Frederick Behnke, Carlaton Wong, Albert Barrett Hicks, III, Steven Darrell Marcus, Joseph Frederick Sommers, Christopher Laurent Beaudry, Timothy Joseph Franklin
-
Patent number: 11699571Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.Type: GrantFiled: September 8, 2020Date of Patent: July 11, 2023Assignee: Applied Materials, Inc.Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
-
Patent number: 11560626Abstract: Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.Type: GrantFiled: May 18, 2020Date of Patent: January 24, 2023Assignee: Applied Materials, Inc.Inventors: Timothy Joseph Franklin, Adam Fischbach, Edward Haywood, Abhijit B. Mallick, Pramit Manna, Carlaton Wong, Stephen C. Garner, Eswaranand Venkatasubramanian
-
Publication number: 20220293452Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.Type: ApplicationFiled: March 7, 2022Publication date: September 15, 2022Inventors: Alexander SULYMAN, Carlaton WONG, Rajinder DHINDSA, Timothy Joseph FRANKLIN, Steven BABAYAN, Anwar HUSAIN, James Hugh ROGERS, Xue Yang CHANG
-
Publication number: 20220293451Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.Type: ApplicationFiled: March 7, 2022Publication date: September 15, 2022Inventors: Alexander SULYMAN, Anwar HUSAIN, Timothy Joseph FRANKLIN, Carlaton WONG, Xue Yang CHANG
-
Publication number: 20220102117Abstract: Embodiments of components for use in substrate process chambers are provided herein. In some embodiments, a component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.Type: ApplicationFiled: September 25, 2020Publication date: March 31, 2022Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
-
Publication number: 20220093361Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate having a plurality of recursive gas paths and one or more cooling channels disposed therein, wherein each of the plurality of recursive gas paths is fluidly coupled to a single gas inlet extending to a first side of the chill plate and a plurality of gas outlets extending to a second side of the chill plate; and a heater plate coupled to the chill plate, wherein the heater plate includes a plurality of first gas distribution holes extending from a top surface thereof to a plurality of plenums disposed within the heater plate, the plurality of first gas distribution holes corresponding with the plurality of gas outlets of the chill plate, and a plurality of second gas distribution holes extending from the plurality of plenums to a lower surface of the heater plate.Type: ApplicationFiled: September 22, 2020Publication date: March 24, 2022Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
-
Publication number: 20220093362Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate comprising a gas plate and a cooling plate having an aluminum-silicon foil interlayer disposed therebetween for diffusion bonding the gas plate to the cooling plate and a heater plate comprising a first plate, a second plate, and a third plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the cooling plate for diffusion bonding the first plate to the cooling plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the second plate for diffusion bonding the first plate to the second plate, and wherein an aluminum-silicon foil interlayer is disposed between the second plate and the third plate for diffusion bonding the second plate to the third plate.Type: ApplicationFiled: July 8, 2021Publication date: March 24, 2022Inventors: Joseph Frederick BEHNKE, Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN, Joseph F. SOMMERS
-
Publication number: 20220076920Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.Type: ApplicationFiled: September 8, 2020Publication date: March 10, 2022Applicant: Applied Materials, Inc.Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
-
Publication number: 20210391146Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of processing a substrate in an etch process chamber includes: pulsing RF power from an RF bias power supply to a lower electrode disposed in a substrate support of the etch process chamber at a first frequency of about 200 kHz to about 700 kHz over a first period to create a plasma in a process volume of the etch process chamber, wherein a conductance liner surrounds the process volume to provide a ground path for an upper electrode of the etch process chamber; and pulsing RF power from the RF bias power supply to the lower electrode at a second frequency of about 2 MHz to about 13.56 MHz over the first period.Type: ApplicationFiled: June 11, 2020Publication date: December 16, 2021Inventors: Timothy Joseph FRANKLIN, Rajinder DHINDSA, Daniel Sang BYUN, Carlaton WONG, Joseph PERRY, James Hugh ROGERS
-
Publication number: 20210331183Abstract: Embodiments of showerhead assemblies and fasteners for use in coupling components of showerhead assemblies are provided herein. More particularly, the fasteners described herein can advantageously be used to connect a gas distribution plate to a backing plate of the showerhead assembly. The fasteners described herein can further advantageously be used to robustly connect components together where the components have different coefficients of thermal expansion.Type: ApplicationFiled: April 26, 2021Publication date: October 28, 2021Inventors: Carlaton WONG, Reyn Tetsuro WAKABAYASHI
-
Publication number: 20210285101Abstract: An apparatus for processing substrates that includes a process chamber with a process volume and a conductance liner surrounding the process volume wherein the conductance liner has at least one fixed portion and a movable portion. The movable portion is configured to expose a substrate transfer slot in a wall of the process chamber. The apparatus also includes a lifting assembly with an actuator attached to the movable portion of the conductance liner. The lifting assembly is configured to move the movable portion of the conductance liner in a vertical direction to expose the substrate transfer slot.Type: ApplicationFiled: March 12, 2020Publication date: September 16, 2021Inventors: TIMOTHY JOSEPH FRANKLIN, RAJINDER DHINDSA, DANIEL SANG BYUN, CARLATON WONG
-
Patent number: D946534Type: GrantFiled: October 25, 2019Date of Patent: March 22, 2022Assignee: Applied Materials, Inc.Inventors: Adam Fischbach, Kien N. Chuc, Canfeng Lai, Carlaton Wong