Patents by Inventor Carlaton WONG

Carlaton WONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12278089
    Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: April 15, 2025
    Assignee: Applied Materials, Inc.
    Inventors: Michael Andrew Stearns, Kartik Ramaswamy, Carlaton Wong
  • Patent number: 12211734
    Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: January 28, 2025
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Alexander Sulyman, Carlaton Wong, Rajinder Dhindsa, Timothy Joseph Franklin, Steven Babayan, Anwar Husain, James Hugh Rogers, Xue Yang Chang
  • Patent number: 12068137
    Abstract: A component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: August 20, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Reyn Tetsuro Wakabayashi, Carlaton Wong, Timothy Joseph Franklin
  • Publication number: 20240266152
    Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a concentric coil region comprising a first concentric coil and a second concentric coil, and a power supply circuit coupled to the first concentric coil and the second concentric coil. The first concentric coil may include a first coil with a diameter measured in a direction parallel to a first plane that is smaller than the diameter of a second coil included in the second concentric coil. The power supply circuit may be configured to bias the first concentric coil and the second concentric coil to adjust a generated magnetic field in a region of control of a plasma in the plasma processing chamber to control a plasma density of the plasma.
    Type: Application
    Filed: February 8, 2023
    Publication date: August 8, 2024
    Inventors: Michael Andrew STEARNS, Alok RANJAN, Kartik RAMASWAMY, Peng TIAN, Timothy Joseph FRANKLIN, Chris BLANK, Carlaton WONG
  • Publication number: 20240258070
    Abstract: Embodiments of the present disclosure include an apparatus and methods for the plasma processing of a substrate. Some embodiments are directed to a plasma processing chamber. The plasma processing chamber generally includes a planar coil region comprising a plurality of planar coils, a first power supply circuit coupled to at least two of the plurality of planar coils, a concentric coil region at least partially surrounding the planar coil region, and a second power supply circuit coupled to at least two of a plurality of concentric coils. The first power supply circuit may be configured to bias the at least two of the plurality of planar coils to affect a plasma in a center region of the plasma processing chamber, and the second power supply circuit may be configured to bias the at least two of the plurality of concentric coils to affect the plasma in an outer region.
    Type: Application
    Filed: January 31, 2023
    Publication date: August 1, 2024
    Inventors: Michael Andrew STEARNS, Kartik RAMASWAMY, Carlaton WONG
  • Patent number: 12020977
    Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.
    Type: Grant
    Filed: March 7, 2022
    Date of Patent: June 25, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Alexander Sulyman, Anwar Husain, Timothy Joseph Franklin, Carlaton Wong, Xue Yang Chang
  • Publication number: 20230343552
    Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.
    Type: Application
    Filed: June 28, 2023
    Publication date: October 26, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
  • Publication number: 20230323531
    Abstract: A method includes affixing a supply apparatus to inlets for one or more channels of a chamber component. The channels provide one or more gas flow paths between a first side of the chamber component that comprises the inlets and a second side of the chamber component comprising outlets of the one or more channels. The method further includes affixing an exhaust apparatus to the outlets of the one or more channels. The method further includes performing a plurality of atomic layer deposition cycles to deposit a corrosion resistant coating on interior surfaces of the one or more channels of the chamber component.
    Type: Application
    Filed: December 27, 2022
    Publication date: October 12, 2023
    Inventors: Joseph Frederick Behnke, Carlaton Wong, Albert Barrett Hicks, III, Steven Darrell Marcus, Joseph Frederick Sommers, Christopher Laurent Beaudry, Timothy Joseph Franklin
  • Patent number: 11699571
    Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: July 11, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
  • Patent number: 11560626
    Abstract: Embodiments of the present disclosure generally relate to apparatus and methods utilized in the manufacture of semiconductor devices. More particularly, embodiments of the present disclosure relate to a substrate processing chamber, and components thereof, for forming semiconductor devices.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: January 24, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Timothy Joseph Franklin, Adam Fischbach, Edward Haywood, Abhijit B. Mallick, Pramit Manna, Carlaton Wong, Stephen C. Garner, Eswaranand Venkatasubramanian
  • Publication number: 20220293452
    Abstract: Methods and apparatus for a lift pin mechanism for substrate processing chambers are provided herein. In some embodiments, the lift pin mechanism includes a lift pin comprising a shaft with a top end, a bottom end, and a coupling end at the bottom end; a bellows assembly disposed about the shaft. The bellows assembly includes an upper bellows flange having an opening for axial movement of the shaft; a bellows having a first end coupled to a lower surface of the upper bellows flange such that the shaft extends into a central volume surrounded by the bellows; and a bellows guide assembly coupled to a second end of the bellows to seal the central volume. The shaft is coupled to the bellows guide assembly at the coupling end. The bellows guide assembly is axially movable to move the lift pin with respect to the upper bellows flange.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 15, 2022
    Inventors: Alexander SULYMAN, Carlaton WONG, Rajinder DHINDSA, Timothy Joseph FRANKLIN, Steven BABAYAN, Anwar HUSAIN, James Hugh ROGERS, Xue Yang CHANG
  • Publication number: 20220293451
    Abstract: Methods and apparatus for lift pin assemblies for substrate processing chambers are provided. In some embodiments, a lift pin assembly includes a lift pin comprising a shaft, a head, and a coupling end, the head configured to rest against an electrostatic chuck; an upper guide comprising a top end, a bottom end, and a first opening extending from the top end to the bottom end, wherein the shaft is disposed and axially movable through the first opening; a lower guide comprising a top end, a bottom end, and a second opening and a third opening extending from the top end to the bottom end, wherein the third opening is larger than the second opening, and wherein the shaft is disposed and axially movable through the second opening and the third opening; and a biasing mechanism coupled to the shaft and configured to bias the lift pin against the electrostatic chuck.
    Type: Application
    Filed: March 7, 2022
    Publication date: September 15, 2022
    Inventors: Alexander SULYMAN, Anwar HUSAIN, Timothy Joseph FRANKLIN, Carlaton WONG, Xue Yang CHANG
  • Publication number: 20220102117
    Abstract: Embodiments of components for use in substrate process chambers are provided herein. In some embodiments, a component for use in a substrate process chamber includes: a body having an opening extending partially through the body from a top surface of the body, wherein the opening includes a threaded portion for fastening the body to a second process chamber component, wherein the threaded portion includes a plurality of threads defining a plurality of rounded crests and a plurality of rounded roots, and wherein a depth of the threaded portion, being a radial distance between a rounded crest of the plurality of rounded crests and an adjacent root of the plurality of rounded roots, decreases from a first depth to a second depth at a last thread of the plurality of threads.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
  • Publication number: 20220093361
    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate having a plurality of recursive gas paths and one or more cooling channels disposed therein, wherein each of the plurality of recursive gas paths is fluidly coupled to a single gas inlet extending to a first side of the chill plate and a plurality of gas outlets extending to a second side of the chill plate; and a heater plate coupled to the chill plate, wherein the heater plate includes a plurality of first gas distribution holes extending from a top surface thereof to a plurality of plenums disposed within the heater plate, the plurality of first gas distribution holes corresponding with the plurality of gas outlets of the chill plate, and a plurality of second gas distribution holes extending from the plurality of plenums to a lower surface of the heater plate.
    Type: Application
    Filed: September 22, 2020
    Publication date: March 24, 2022
    Inventors: Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN
  • Publication number: 20220093362
    Abstract: Embodiments of showerheads are provided herein. In some embodiments, a showerhead assembly includes a chill plate comprising a gas plate and a cooling plate having an aluminum-silicon foil interlayer disposed therebetween for diffusion bonding the gas plate to the cooling plate and a heater plate comprising a first plate, a second plate, and a third plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the cooling plate for diffusion bonding the first plate to the cooling plate, wherein an aluminum-silicon foil interlayer is disposed between the first plate and the second plate for diffusion bonding the first plate to the second plate, and wherein an aluminum-silicon foil interlayer is disposed between the second plate and the third plate for diffusion bonding the second plate to the third plate.
    Type: Application
    Filed: July 8, 2021
    Publication date: March 24, 2022
    Inventors: Joseph Frederick BEHNKE, Reyn Tetsuro WAKABAYASHI, Carlaton WONG, Timothy Joseph FRANKLIN, Joseph F. SOMMERS
  • Publication number: 20220076920
    Abstract: Exemplary semiconductor substrate supports may include a pedestal shaft. The semiconductor substrate supports may include a platen. The platen may define a fluid channel across a first surface of the platen. The semiconductor substrate supports may include a platen insulator positioned between the platen and the pedestal shaft. The semiconductor substrate supports may include a conductive puck coupled with the first surface of the platen and configured to contact a substrate supported on the semiconductor substrate support. The semiconductor substrate supports may include a conductive shield extending along a backside of the platen insulator and coupled between a portion of the platen insulator and the pedestal shaft.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Applicant: Applied Materials, Inc.
    Inventors: Khokan Chandra Paul, Ravikumar Patil, Vijet Patil, Carlaton Wong, Adam J. Fischbach, Timothy Franklin, Tsutomu Tanaka, Canfeng Lai
  • Publication number: 20210391146
    Abstract: Methods and apparatus for processing a substrate are provided herein. In some embodiments, a method of processing a substrate in an etch process chamber includes: pulsing RF power from an RF bias power supply to a lower electrode disposed in a substrate support of the etch process chamber at a first frequency of about 200 kHz to about 700 kHz over a first period to create a plasma in a process volume of the etch process chamber, wherein a conductance liner surrounds the process volume to provide a ground path for an upper electrode of the etch process chamber; and pulsing RF power from the RF bias power supply to the lower electrode at a second frequency of about 2 MHz to about 13.56 MHz over the first period.
    Type: Application
    Filed: June 11, 2020
    Publication date: December 16, 2021
    Inventors: Timothy Joseph FRANKLIN, Rajinder DHINDSA, Daniel Sang BYUN, Carlaton WONG, Joseph PERRY, James Hugh ROGERS
  • Publication number: 20210331183
    Abstract: Embodiments of showerhead assemblies and fasteners for use in coupling components of showerhead assemblies are provided herein. More particularly, the fasteners described herein can advantageously be used to connect a gas distribution plate to a backing plate of the showerhead assembly. The fasteners described herein can further advantageously be used to robustly connect components together where the components have different coefficients of thermal expansion.
    Type: Application
    Filed: April 26, 2021
    Publication date: October 28, 2021
    Inventors: Carlaton WONG, Reyn Tetsuro WAKABAYASHI
  • Publication number: 20210285101
    Abstract: An apparatus for processing substrates that includes a process chamber with a process volume and a conductance liner surrounding the process volume wherein the conductance liner has at least one fixed portion and a movable portion. The movable portion is configured to expose a substrate transfer slot in a wall of the process chamber. The apparatus also includes a lifting assembly with an actuator attached to the movable portion of the conductance liner. The lifting assembly is configured to move the movable portion of the conductance liner in a vertical direction to expose the substrate transfer slot.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 16, 2021
    Inventors: TIMOTHY JOSEPH FRANKLIN, RAJINDER DHINDSA, DANIEL SANG BYUN, CARLATON WONG
  • Patent number: D946534
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: March 22, 2022
    Assignee: Applied Materials, Inc.
    Inventors: Adam Fischbach, Kien N. Chuc, Canfeng Lai, Carlaton Wong