Patents by Inventor Carlo Cognetti De Martiis

Carlo Cognetti De Martiis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8482116
    Abstract: A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: July 9, 2013
    Assignees: STMicroelectronics (Grenoble 2) SAS, STMicroelectronics S.r.l.
    Inventors: Romain Coffy, Remi Brechignac, Carlo Cognetti de Martiis
  • Publication number: 20110248397
    Abstract: A semiconductor device includes at least one first component (5) (for example, a first integrated circuit), having a front face provided with electrical connection pads. The first component is embedded in a support layer (2) is a position such that the front face of the first component is not covered and lies parallel to a first face of the support layer. An intermediate layer (8) is formed on the front face of the first component and on the first face of the support layer. An electrical connection network (9) within the intermediate layer selectively connects to the electrical connection pads of the first component. The device further includes at least one second component (11) (for example, a second integrate circuit, having one face placed above the intermediate layer and provided with electrical connection pads selectively connected to the electrical connection network.
    Type: Application
    Filed: November 10, 2009
    Publication date: October 13, 2011
    Applicants: STMICROELECTRONICS S.R.L., STMICROELECTRONICS (GRENOBLE) SAS
    Inventors: Romain Coffy, Remi Brechignac, Carlo Cognetti De Martiis
  • Patent number: 5237485
    Abstract: A heat sink and method for heat sinking a package containing electronic components is described. The heat sinking is accomplished by use of a cooling plate located beneath a circuit board. The package having leads extending from more than one side of the package is positioned on the cooling plate so that the leads from the sides of the package can be electrically coupled to conductors on the circuit board wherein the circuit board is disposed about at least two and preferably three sides of the package. The package is secured to the cooling plate by a spring clip. The spring clip permits flexible positioning of the package relative to the cooling plate including positioning the package in close proximity of the edge of the cooling plate. Thermal conduction between the package and the cooling plate can be enhanced by the presence of a compressible thermally-conducting material.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: August 17, 1993
    Assignee: SGS Microelettronica S.p.A.
    Inventors: Carlo Cognetti de Martiis, Bruno Murari
  • Patent number: 4712127
    Abstract: A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.
    Type: Grant
    Filed: November 29, 1983
    Date of Patent: December 8, 1987
    Assignee: SGS-ATES Componenti Elettronici SpA
    Inventors: Piero Colombo, Marino Cellai, Carlo Cognetti de Martiis
  • Patent number: 4711023
    Abstract: Method for making an insulating package premolded on a metallic frame with electrical contacts containing in an inner space a semiconductor chip which rests on a thermic dissipator and is connected to the electrical contacts. The inner space of the package is closed on top by a cover provided with a lateral extension with a bent end, which operates not only as a cover, but also as a means for fastening and thrusting the package toward a support surface.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: December 8, 1987
    Assignee: SGS-Antes Componenti Elettronici S.p.A.
    Inventors: Giuseppe Marchisi, Carlo Cognetti De Martiis