Abstract: A module is provided with a thin-film circuit. To realize the module with a thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate (1) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which is very compact.

Abstract: The invention describes a module provided with a thin-film circuit. To realize the module with thin-film circuit, capacitors, or capacitors and resistors, or capacitors, resistors and inductors are provided next to the conductor tracks directly on a substrate (1) of an insulating material. The partial or full integration of passive elements leads to the creation of a module which requires little space.

Abstract: The invention relates to a module provided with a thin-film circuit which comprises an integrated trimmable capacitor. At least one electrically conducting layer (2, 4) of the capacitor has a structured surface with recesses. This finger-type design has the result that the actual capacitor is composed of several capacitors connected in parallel. After the total capacitance value has been determined, this total capacitance value can be fine tuned through a selective cutting-off of fingers, i.e. of capacitors, from the main surface of the electrically conducting layer (2, 4).

Abstract: The invention relates to a structured superconductive track and a process for making it from epitaxial high temperature superconductor (HTSC) layers using lift off technique, in which a HTSC track deposited on an elevated substrate region is surrounded by an insulating layer of doped HTSC lying on a lower substrate region, and the substrate region with the superconductive track formed thereon is elevated such that the superconductive track is isolated from the insulating layer.