Patents by Inventor Carlo Minotti

Carlo Minotti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular semiconductor power device
    Patent number: 5038198
    Abstract: A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
    Type: Grant
    Filed: January 9, 1990
    Date of Patent: August 6, 1991
    Assignee: SGS-Thomson Microelectronics S.p.A.
    Inventors: Antonio Perniciaro Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina
  • Method for manufacturing a modular semiconductor power device
    Patent number: 4926547
    Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.
    Type: Grant
    Filed: June 27, 1989
    Date of Patent: May 22, 1990
    Assignee: SGS-Thomson Microelectronics S.p.A.
    Inventors: Antonio P. Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina
  • Method for manufacturing a modular semiconductor power device
    Patent number: RE37416
    Abstract: The components used in the method comprise a heat-dissipating base plate, one or more three-layer plates (the top layer consisting of copper plates and strips) and a one-piece frame designed to constitute the terminals. After the chips have been soldered onto the upper plates and connected to the strips, the inner ends of the frame are soldered to points of connection with the chips. This is followed by the encapsulation in resin and the shearing of the outer portions of the frame, which, during the process, serve to temporarily connect the terminals.
    Type: Grant
    Filed: November 13, 1995
    Date of Patent: October 23, 2001
    Assignee: STMicroelectronics S.r.l.
    Inventors: Antonio P. Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina
  • Modular semiconductor power device
    Patent number: RE38037
    Abstract: A modular semiconductor power device has a conductive member consisting of an alumina plate to which copper layers are soldered on opposite sides. A chip is soldered to one of these layers and the other of these layers is soldered in turn to a metal heat sink. The chip is connected to respective copper strips which, in turn, are soldered to thermal strips originally forming part of a frame so that, after the device is encapsulated in a synthetic resin, the connecting members of the frame can be cut away to leave free ends of the latter strips exposed.
    Type: Grant
    Filed: January 21, 1994
    Date of Patent: March 18, 2003
    Assignee: STMicroelectronics S.r.l.
    Inventors: Antonio Perniciaro Spatrisano, Luciano Gandolfi, Carlo Minotti, Natale Di Cristina