Patents by Inventor Carlo Tiongson

Carlo Tiongson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packages and methods for packaging
    Patent number: 9142470
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 22, 2015
    Assignee: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • PACKAGES AND METHODS FOR PACKAGING
    Publication number: 20140332947
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 13, 2014
    Applicant: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Packages and methods for packaging using a lid having multiple conductive layers
    Patent number: 8723308
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Grant
    Filed: November 17, 2011
    Date of Patent: May 13, 2014
    Assignee: Analog Devices, Inc.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Rick Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • PACKAGES AND METHODS FOR PACKAGING
    Publication number: 20120126347
    Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
    Type: Application
    Filed: November 17, 2011
    Publication date: May 24, 2012
    Applicant: ANALOG DEVICES, INC.
    Inventors: Jicheng Yang, Asif Chowdhury, Manolo Mena, Jia Gao, Richard Sullivan, Thomas Goida, Carlo Tiongson, Dipak Sengupta
  • Semiconductor dice with edge cavities
    Publication number: 20050056871
    Abstract: A rounded wafer blade and stacked semiconductor package having a die with a cavity defined by a curved lower surface thereof. The curved lower surface and cavity allow for wire bonding directly therebelow at the top surface of another die of the semiconductor package. Additionally, wire bonding may proceed at a surface of the die opposite the curved lower surface without significant impact on a structural integrity of the die.
    Type: Application
    Filed: October 27, 2004
    Publication date: March 17, 2005
    Inventors: Reginald Taar, Anthony Dajac, Carlo Tiongson