Patents by Inventor Carlos Alberto Lopez Collier de la Marliere

Carlos Alberto Lopez Collier de la Marliere has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240307968
    Abstract: Examples of methods are described herein. In some examples, a method includes predicting a first sintering state of an object using a first machine learning model trained based on a first time segment. In some examples, the method includes predicting a second sintering state of the object using a second machine learning model trained based on a second time segment. In some examples, the method includes combining, using a fusion machine learning model, the first sintering state and the second sintering state to produce an overall sintering state.
    Type: Application
    Filed: July 14, 2021
    Publication date: September 19, 2024
    Applicant: HEWLETT-PACKARD DEVELPOMENT COMPANY, L.P.
    Inventors: Zi-Jiang YANG, Chuang GAN, Lei CHEN, Carlos Alberto LOPEZ COLLIER DE LA MARLIERE, Yu XU, Juheon LEE, Jun ZENG
  • Publication number: 20240184954
    Abstract: Examples of methods for iterative model compensation are described herein. In some examples, a method includes predicting, in an iteration, a deformed model based on an object model. In some examples, the method includes determining, in the iteration, a disparity between the object model and the deformed model. In some examples, the method includes determining, in a next iteration, a compensated model based on the disparity and a relaxation factor.
    Type: Application
    Filed: April 21, 2021
    Publication date: June 6, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Carlos Alberto LOPEZ COLLIER DE LA MARLIERE, Jorge Alberto BECERRA VELAZQUEZ, Lei CHEN, Jun ZENG
  • Publication number: 20220171903
    Abstract: Examples of methods for adapting simulations are described herein. In some examples, a method may include simulating three-dimensional (3D) manufacturing. In some examples, the method may include adapting a boundary condition of the simulation of the 3D manufacturing based on a measurement from a thermal sensor at a point of a build enclosure.
    Type: Application
    Filed: July 19, 2019
    Publication date: June 2, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan
  • Publication number: 20220152936
    Abstract: Examples of methods generated thermal images are described. In some examples, a method may include simulating three-dimensional (3D) manufacturing to produce a simulated thermal image at a first resolution. In some examples, the method may include generating a thermal image at a second resolution based on the simulated thermal image. In some examples, the second resolution is greater than the first resolution.
    Type: Application
    Filed: July 31, 2019
    Publication date: May 19, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: He Luan, Jun Zheng, Carlos Alberto Lopez-Collier de la Marliere
  • Publication number: 20220088878
    Abstract: Examples of methods for adapting a simulation of three-dimensional (3D) manufacturing are described herein. In some examples, a method includes determining, using a machine learning model, a predicted thermal image based on a thermal imaging stream of 3D manufacturing. In some examples, a method includes adapting a simulation of the 3D manufacturing based on the predicted thermal image.
    Type: Application
    Filed: June 11, 2019
    Publication date: March 24, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Jun Zeng, Carlos Alberto Lopez Collier de la Marliere, He Luan