Patents by Inventor Carlos Alberto Pons Siepermann

Carlos Alberto Pons Siepermann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for rapid laser drilling of holes in glass and products made therefrom
    Patent number: 11148225
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Grant
    Filed: November 7, 2018
    Date of Patent: October 19, 2021
    Assignee: Corning Incorporated
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
  • METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM
    Publication number: 20190084090
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Application
    Filed: November 7, 2018
    Publication date: March 21, 2019
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
  • Method for rapid laser drilling of holes in glass and products made therefrom
    Patent number: 10144093
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: December 4, 2018
    Assignee: Corning Incorporated
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
  • METHOD FOR RAPID LASER DRILLING OF HOLES IN GLASS AND PRODUCTS MADE THEREFROM
    Publication number: 20160368100
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Application
    Filed: August 30, 2016
    Publication date: December 22, 2016
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
  • Method for rapid laser drilling of holes in glass and products made therefrom
    Patent number: 9517963
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: December 13, 2016
    Assignee: Corning Incorporated
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner
  • Method for Rapid Laser Drilling of Holes in Glass and Products Made Therefrom
    Publication number: 20150166395
    Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.
    Type: Application
    Filed: November 7, 2014
    Publication date: June 18, 2015
    Inventors: Sasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner