Patents by Inventor Carlos Alvizo Flores

Carlos Alvizo Flores has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic systems with inverted circuit board with heat sink to chassis attachment
    Patent number: 12131977
    Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.
    Type: Grant
    Filed: October 31, 2023
    Date of Patent: October 29, 2024
    Assignee: Intel Corporation
    Inventors: Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L Smalley, Minh T. D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Carlos Alvizo Flores, Fernando Gonzalez Lenero
  • ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CHASSIS ATTACHMENT
    Publication number: 20240063082
    Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Inventors: Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L. Smalley, Minh T.D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Carlos Alvizo Flores, Fernando Gonzalez Lenero
  • Electronic systems with inverted circuit board with heat sink to chassis attachment
    Patent number: 11842943
    Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: December 12, 2023
    Assignee: INTEL CORPORATION
    Inventors: Barrett M. Faneuf, Phil Geng, Kenan Arik, David Shia, Casey Winkel, Sandeep Ahuja, Eric D. McAfee, Jeffory L. Smalley, Minh T. D. Le, Ralph V. Miele, Marc Milobinski, Aaron P. Anderson, Brendan T. Pavelek, Fernando Gonzalez Lenero, Carlos Alvizo Flores
  • Modular thermal energy management designs for data center computing
    Patent number: 11032941
    Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: June 8, 2021
    Assignee: Intel Corporation
    Inventors: Minh Le, Thomas Boyd, Bijoyraj Sahu, Evan Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores, Craig Jahne
  • MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING
    Publication number: 20190223324
    Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: March 28, 2019
    Publication date: July 18, 2019
    Inventors: Minh Le, Thomas Boyd, Bijoyraj Sahu, Evan Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores, Craig Jahne