Patents by Inventor Carlos Anthony Sanchez
Carlos Anthony Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11552211Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.Type: GrantFiled: July 19, 2018Date of Patent: January 10, 2023Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
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Patent number: 10553697Abstract: Methods are provided for fabricating a HEMT (high-electron-mobility transistor) that involve sequential epitaxial growth of III-nitride channel and barrier layers, followed by epitaxial regrowth of further III-nitride material through a window in a mask layer. The regrowth takes place on the barrier layer, only in the access region or regions. Devices made according to the disclosed methods are also provided.Type: GrantFiled: April 16, 2019Date of Patent: February 4, 2020Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Andrew Armstrong, Albert G. Baca, Andrew A. Allerman, Carlos Anthony Sanchez, Erica Ann Douglas, Robert Kaplar
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Patent number: 10388753Abstract: Methods are provided for fabricating a HEMT (high-electron-mobility transistor) that involve sequential epitaxial growth of III-nitride channel and barrier layers, followed by epitaxial regrowth of further III-nitride material through a window in a mask layer. In examples, the regrowth takes place over exposed portions of the channel layer in the source and drain regions of the device, and the regrown material has a composition different from the barrier layer. In other examples, the regrowth takes place on the barrier layer, only in the access region or regions. Devices made according to the disclosed methods are also provided.Type: GrantFiled: March 14, 2018Date of Patent: August 20, 2019Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Andrew Armstrong, Albert G. Baca, Andrew A. Allerman, Carlos Anthony Sanchez, Erica Ann Douglas, Robert Kaplar
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Patent number: 10304977Abstract: A method, system and apparatus including a device cell having a top side, a bottom side and opposing side walls. A passivation layer is formed along the top side, the bottom side and opposing side walls of the device cell. The passivation layer serves to passivate the device cell and facilitate carrier collection around the device cell. An anti-reflective layer is formed over the passivation layer and an optical layer is formed on the top side of the device cell. The optical layer reflects light within the device cell. The apparatus may further include a reflective layer formed along the bottom side of the device cell, the reflective layer to reflect light internally within the device cell.Type: GrantFiled: May 11, 2015Date of Patent: May 28, 2019Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez
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Patent number: 10243095Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.Type: GrantFiled: July 19, 2018Date of Patent: March 26, 2019Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
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Publication number: 20180323325Abstract: A method is provided for making a molded photovoltaic module. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.Type: ApplicationFiled: July 19, 2018Publication date: November 8, 2018Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
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Publication number: 20180323324Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.Type: ApplicationFiled: July 19, 2018Publication date: November 8, 2018Inventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
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Patent number: 10038113Abstract: A moldable photovoltaic module is provided. The module includes a flexible polymeric flex-circuit substrate having an electrically conductive printed wiring pattern and solder pads defined on it. Small photovoltaic cells are affixed to the flex-circuit substrate by back-surface contacts in electrical contact with the solder pads. At least one thermoformable polymeric film is joined to the flex-circuit substrate. Each said solder pad comprises a solder composition that, after an initial melt, has a melting point that lies above at least a portion of the temperature range for thermoforming the polymeric film.Type: GrantFiled: November 24, 2015Date of Patent: July 31, 2018Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Jeffrey S. Nelson, Michael Hibbs, Gregory N. Nielson, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick, Carlos Anthony Sanchez, Vipin P. Gupta, Peggy J. Clews
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Patent number: 9748415Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.Type: GrantFiled: November 23, 2016Date of Patent: August 29, 2017Assignee: Sandia CorporationInventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
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Publication number: 20170162724Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.Type: ApplicationFiled: November 23, 2016Publication date: June 8, 2017Inventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
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Patent number: 9559219Abstract: A method including providing a substrate comprising a device layer on which a plurality of device cells are defined; depositing a first dielectric layer on the device layer and metal interconnect such that the deposited interconnect is electrically connected to at least two of the device cells; depositing a second dielectric layer over the interconnect; and exposing at least one contact point on the interconnect through the second dielectric layer. An apparatus including a substrate having defined thereon a device layer including a plurality of device cells; a first dielectric layer disposed directly on the device layer; a plurality of metal interconnects, each of which is electrically connected to at least two of the device cells; and a second dielectric layer disposed over the first dielectric layer and over the interconnects, wherein the second dielectric layer is patterned in a positive or negative planar spring pattern.Type: GrantFiled: June 19, 2015Date of Patent: January 31, 2017Assignee: Sandia CorporationInventors: Murat Okandan, Gregory N. Nielson, Jose Luis Cruz-Campa, Carlos Anthony Sanchez
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Patent number: 9126392Abstract: A process including forming a photovoltaic solar cell on a substrate, the photovoltaic solar cell comprising an anchor positioned between the photovoltaic solar cell and the substrate to suspend the photovoltaic solar cell from the substrate. A surface of the photovoltaic solar cell opposite the substrate is attached to a receiving substrate. The receiving substrate may be bonded to the photovoltaic solar cell using an adhesive force or a metal connecting member. The photovoltaic solar cell is then detached from the substrate by lifting the receiving substrate having the photovoltaic solar cell attached thereto and severing the anchor connecting the photovoltaic solar cell to the substrate. Depending upon the type of receiving substrate used, the photovoltaic solar cell may be removed from the receiving substrate or remain on the receiving substrate for use in the final product.Type: GrantFiled: September 22, 2011Date of Patent: September 8, 2015Assignee: Sandia CorporationInventors: Gregory N. Nielson, Jose Luis Cruz-Campa, Murat Okandan, Paul J. Resnick, Carlos Anthony Sanchez, Peggy J. Clews, Vipin P. Gupta
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Publication number: 20150221627Abstract: An apparatus is disclosed that includes a first plurality of devices made of a group III-V semiconductor material and a second plurality of devices made of a semiconductor material different than the material of the first plurality of devices that are bonded to the first plurality of devices. The apparatus also includes a dielectric layer surrounding the first plurality of devices and the second plurality of devices to mechanically bond the first plurality of devices to the second plurality of devices.Type: ApplicationFiled: September 25, 2013Publication date: August 6, 2015Inventors: Gregory N. Nielson, Carlos Anthony Sanchez, Anna Tauke-Pedretti, Bonsang Kim, Jeffrey Cederberg, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick
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Patent number: 8946052Abstract: A method includes forming a release layer over a donor substrate. A plurality of devices made of a first semiconductor material are formed over the release layer. A first dielectric layer is formed over the plurality of devices such that all exposed surfaces of the plurality of devices are covered by the first dielectric layer. The plurality of devices are chemically attached to a receiving device made of a second semiconductor material different than the first semiconductor material, the receiving device having a receiving substrate attached to a surface of the receiving device opposite the plurality of devices. The release layer is etched to release the donor substrate from the plurality of devices. A second dielectric layer is applied over the plurality of devices and the receiving device to mechanically attach the plurality of devices to the receiving device.Type: GrantFiled: September 26, 2012Date of Patent: February 3, 2015Assignee: Sandia CorporationInventors: Gregory N. Nielson, Carlos Anthony Sanchez, Anna Tauke-Pedretti, Bongsang Kim, Jeffrey Cederberg, Murat Okandan, Jose Luis Cruz-Campa, Paul J. Resnick