Abstract: A bucket stand is described herein. The bucket stand has a body for receiving and supporting cylindrical objects such as paint containers. Within the body is a padding for securing the cylindrical objects, so that when a user lifts the cylindrical object, for example, the paint container's handle, the bucket stand is lifted too. This permits better portability of both objects without having to separate them and carry each individually. Furthermore, the cylindrical object is only temporarily secured within the bucket stand for easy removal of the object when desired. The bucket stand is also able to be further elevated and includes wheels to enable sliding of the stand. Additional padding is utilized to allow various sizes of cylindrical objects to be retained. Some embodiments utilize angled walls, magnets and fasteners to further assist in securing the cylindrical objects within the bucket stand.

Abstract: A bucket stand is described herein. The bucket stand has a body for receiving and supporting cylindrical objects such as paint containers. Within the body is a padding for securing the cylindrical objects, so that when a user lifts the cylindrical object, for example, the paint container's handle, the bucket stand is lifted too. This permits better portability of both objects without having to separate them and carry each individually. Furthermore, the cylindrical object is only temporarily secured within the bucket stand for easy removal of the object when desired. The bucket stand is also able to be further elevated and includes wheels to enable sliding of the stand. Additional padding is utilized to allow various sizes of cylindrical objects to be retained. Some embodiments utilize angled walls, magnets and fasteners to further assist in securing the cylindrical objects within the bucket stand.

Abstract: A semiconductor device with a semiconductor die thereon and a contactor board are electrically coupled when the electrically conductive elements on the semiconductor device and the contactor board are in physical contact. A continuous electrically conductive path is formed with electrically conductive elements involving both the semiconductor device and the contactor board. A complete electrical circuit involving both the semiconductor device and the contactor board is formed only when the relative orientation of the semiconductor device and the contactor board have predetermined relationship and the electrically conductive elements of the two boards are in good physical contact.