Abstract: A system can include a circuit board processing system configured to process a panel having an array of units, with each unit including a surface, and the panel including a surface. The system can further include a module processing system configured to produce packaged modules from the array of units, such that each packaged module includes a surface. The system can further include a character recognition system configured to obtain a digital image of a character imprinted on each of some or all of the surface of the panel, the surface of each unit, and the surface of each packaged module. The character recognition system can be further configured to perform a pattern matching process for the digital image of the character, with the pattern matching process including a principal component analysis to extract a principal characteristic, and linear and quadratic Bayesian discriminant functions to classify and find a correct character that corresponds to the principal characteristic.

Abstract: Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Techniques and systems for recognizing characters on a circuit board are discussed herein. For example, a digital image of a character on a circuit board can be obtained. The digital image can be processed with a gradient, structural, and concavity algorithm. The processing can include identifying a gradient feature based on a stroke shape, identifying a structural feature based on a stroke trajectory, identifying a concavity feature based on a stroke relationship, and so on. The character can be classified based on the gradient feature, the structural feature, and/or the concavity feature. The classifying can be performed using a k-nearest neighbor classifier algorithm and/or a distance metric.

Abstract: Techniques and systems for recognizing characters on a circuit board are discussed herein. For example, a digital image of a character on a circuit board can be obtained. The digital image can be processed with a gradient, structural, and concavity algorithm. The processing can include identifying a gradient feature based on a stroke shape, identifying a structural feature based on a stroke trajectory, identifying a concavity feature based on a stroke relationship, and so on. The character can be classified based on the gradient feature, the structural feature, and/or the concavity feature. The classifying can be performed using a k-nearest neighbor classifier algorithm and/or a distance metric.

Abstract: Systems and methods for recognition of unreadable characters on printed circuit boards. In some embodiments, a method for recognizing characters can be utilized for recognition of damaged characters on a printed circuit board. The method can include obtaining a digital image for each of a plurality of characters on the printed circuit board. The method can further include dividing each digital image into an array of regions. The method can further include generating a data structure from the arrays of the digital images. The data structure can include gradient features based on stroke shapes on small distances, structural features based on stroke trajectories on extended distances, and concavity features based on stroke relationships.

Abstract: Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Systems and methods for identifying potentially defective individual packaged modules are presented. A printed circuit board (PCB) having individual module substrates can be received. An image of the PCB is captured and a PCB recipe associated with the PCB is loaded. For each individual module substrate, a portion of the image corresponding to the individual module substrate is compared to the PCB recipe. It can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. When an individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Systems and methods for recognition of unreadable characters on printed circuit boards. In some embodiments, a method for recognizing characters can be utilized for recognition of damaged characters on a printed circuit board. The method can include obtaining a digital image for each of a plurality of characters on the printed circuit board. The method can further include dividing each digital image into an array of regions. The method can further include generating a data structure from the arrays of the digital images. The data structure can include gradient features based on stroke shapes on small distances, structural features based on stroke trajectories on extended distances, and concavity features based on stroke relationships.

Abstract: Systems and methods for identifying potentially defective individual packaged modules are presented. A printed circuit board (PCB) having individual module substrates can be received. An image of the PCB is captured and a PCB recipe associated with the PCB is loaded. For each individual module substrate, a portion of the image corresponding to the individual module substrate is compared to the PCB recipe. It can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. When an individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Systems and methods for processing potentially defective individual packaged modules are presented. A Printed Circuit Board (PCB) that includes a set of individual module substrates can be received and an image of a first side of the PCB can be captured by an image capture module which can include one or more cameras. Based on the captured image, it can be determined whether the set of individual module substrates includes previously identified (e.g., inked) individual module substrates that correspond to potentially defective individual module substrates. In response to determining that the set of individual module substrates includes inked individual module substrates, a map of the inked individual module substrates can be created. Based on the map, locations corresponding to the inked individual module substrates can be marked with a laser on a second side of the PCB.

Abstract: Systems and methods for identifying defective individual packaged modules are presented. A Printed Circuit Board (PCB) having a set of individual module substrates can be received. Further, capturing an image of the PCB and loading a PCB recipe associated with the PCB can be performed. The image of the PCB can be captured by an image capture module that can include one or more cameras. For each individual module substrate, a portion of the image corresponding to the individual module substrate can be compared to the PCB recipe. In addition, it can be determined based on the comparison whether the individual module substrate matches the PCB recipe within a degree of tolerance. In response to determining that the individual module substrate does not match the PCB recipe within the degree of tolerance, a location of the individual module substrate within a map of the PCB can be stored.

Abstract: Systems and methods for processing potentially defective individual packaged modules are presented. A Printed Circuit Board (PCB) that includes a set of individual module substrates can be received and an image of a first side of the PCB can be captured by an image capture module which can include one or more cameras. Based on the captured image, it can be determined whether the set of individual module substrates includes previously identified (e.g., inked) individual module substrates that correspond to potentially defective individual module substrates. In response to determining that the set of individual module substrates includes inked individual module substrates, a map of the inked individual module substrates can be created. Based on the map, locations corresponding to the inked individual module substrates can be marked with a laser on a second side of the PCB.