Abstract: A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

Abstract: Methods and systems for supporting similar thermal devices may involve collecting, by a thermal module on a management controller of an information handling system, device information about an add-in card, determining whether the add-in card was previously defined by matching the device against a table, searching the table based on the determination that the add-in card was not previously defined, determining whether the add-in card is supported by finding a match in the table, and applying a thermal tier associated with the match in the table based on the determination that the add-in card is supported. The device information collected may involve at least two of a reseller part number, description, device identifier, sub device identifier, vendor identifier, sub vendor identifier, slot identifier, lane width, and auxiliary power indicator. The search of the table may involve at least one of the description, lane width, and sub vendor identifier.

Abstract: A system for controlling one or more fans, comprising an open loop control system configured to receive a CPU power level and to maintain a fan speed at an open loop fan speed level. A closed loop control system configured to receive the CPU power level and temperature, and to modify the fan speed as a function of the CPU power level and temperature, wherein the fan speed is maintained at a level that is not lower than the open loop fan speed level.

Abstract: Heat-rejecting media may thermally couple to a device, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the device and thermally couple between the device and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the device to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the device and thermally couple between the device and a system-level air mover other than the active cooling system and configured to drive airflow to components of a system comprising the device such that the heat transferred to the passive heat-rejecting media from the device is transferred to the airflow driven by the system-level air mover.

Abstract: An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

Abstract: When conflicting thermal parameters for thermal control exist in both of a personality module and one of a power table and a thermal table, wherein the power table comprises a plurality of entries each setting forth supported parameters for power management of one or more information handling resources, wherein the thermal table comprises a plurality of entries each setting forth parameters for thermal management of the one or more information handling resources, and wherein a personality module comprises a plurality of entries each setting forth custom parameters for system-specific power/thermal management of the one or more information handling resources, each entry of the personality module including an attribute associated with the custom parameters, a method may perform selecting one of the conflicting thermal parameters as a selected thermal parameter based on the at least one attribute; and writing an entry associated with the selected thermal parameter to final thermal.

Abstract: Heat-rejecting media may thermally couple to an information handling resource, and the heat-rejecting media may include active heat-rejecting media configured to thermally couple to the information handling resource and thermally couple between the information handling resource and an active cooling system such that the active cooling system causes heat transferred to the active heat-rejecting media from the information handling resource to be transferred from the active heat-rejecting media and passive heat-rejecting media extending from the active heat-rejecting media and configured to thermally couple to the information handling resource and thermally couple between the information handling resource and a system-level air mover other than the active cooling system and configured to drive airflow to components of an information handling system comprising the information handling resource such that the heat transferred to the passive heat-rejecting media from the information handling resource is transferred

Abstract: An airflow characterization system includes a first airflow sensor subsystem positioned at a first location on an airflow characterization board base and a second airflow sensor subsystem positioned at a second location on the airflow characterization board base that is different than the first location. An airflow characterization controller is coupled to the first airflow sensor subsystem and the second airflow sensor subsystem. When the airflow characterization board is positioned in a circuit board slot, the airflow characterization controller receives a first airflow signal from the first airflow sensor subsystem during a first time period and receives a second airflow signal from the second airflow sensor subsystem during the first time period. The airflow characterization controller determines a circuit board slot airflow characterization for the circuit board slot based on the first airflow signal and the second airflow signal.

Abstract: When conflicting thermal parameters for thermal control exist in both of a personality module and one of a power table and a thermal table, wherein the power table comprises a plurality of entries each setting forth supported parameters for power management of one or more information handling resources, wherein the thermal table comprises a plurality of entries each setting forth parameters for thermal management of the one or more information handling resources, and wherein a personality module comprises a plurality of entries each setting forth custom parameters for system-specific power/thermal management of the one or more information handling resources, each entry of the personality module including an attribute associated with the custom parameters, a method may perform selecting one of the conflicting thermal parameters as a selected thermal parameter based on the at least one attribute; and writing an entry associated with the selected thermal parameter to final thermal.

Abstract: Methods and systems for supporting similar thermal devices may involve collecting, by a thermal module on a management controller of an information handling system, device information about an add-in card, determining whether the add-in card was previously defined by matching the device against a table, searching the table based on the determination that the add-in card was not previously defined, determining whether the add-in card is supported by finding a match in the table, and applying a thermal tier associated with the match in the table based on the determination that the add-in card is supported. The device information collected may involve at least two of a reseller part number, description, device identifier, sub device identifier, vendor identifier, sub vendor identifier, slot identifier, lane width, and auxiliary power indicator. The search of the table may involve at least one of the description, lane width, and sub vendor identifier.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, one or more information handling resources communicatively coupled to the processor, and a management controller communicatively coupled to the processor. The management controller may have stored thereon at least one of a power table comprising parameters for power management of the one or more information handling resources and a thermal table comprising parameters for thermal management of the one or more information handling resources, and firmware comprising instructions executable on the management controller and configured to enable a user of the information handling system to, during runtime of the management controller, create a virtual power and thermal table capable of storing one or more entries, each entry setting forth power parameters and thermal parameters for an information handling resource.

Abstract: In accordance with embodiments of the present disclosure, an information handling system may include a processor, one or more information handling resources communicatively coupled to the processor, and a management controller communicatively coupled to the processor. The management controller may have stored thereon at least one of a power table comprising parameters for power management of the one or more information handling resources and a thermal table comprising parameters for thermal management of the one or more information handling resources, and firmware comprising instructions executable on the management controller and configured to enable a user of the information handling system to, during runtime of the management controller, create a virtual power and thermal table capable of storing one or more entries, each entry setting forth power parameters and thermal parameters for an information handling resource.