Abstract: The present invention is directed to a control system for a MEMS device, such as a MEMS mirror, that uses sliding mode analysis to accurately and predictably control the position of the mirrors in a MEMS device. The present invention also uses the capacitance of the mirror to detect the position of the mirror. In one embodiment, a MEMS mirror device mounted on a substrate is described that includes, a micro mirror that is pivotable about an axis, a first conductive layer on the mirror, a second conductive layer on the substrate, the first and second conductive layers form a first capacitor for determining the position of the mirror. The sliding mode control can be implemented using various drive mechanisms, including electrostatic drives. When used with electrostatic drives, conductive layers that create the capacitors can also be used to drive the mirror. The detection-drive system can be time multiplexed to simplify implementation and to avoid cross talk.

Abstract: The present invention is directed to a control system for a MEMS device, such as a MEMS mirror, that uses sliding mode analysis to accurately and predictably control the position of the mirrors in a MEMS device. The present invention also uses the capacitance of the mirror to detect the position of the mirror. In one embodiment, a MEMS mirror device mounted on a substrate is described that includes, a micro mirror that is pivotable about an axis, a first conductive layer on the mirror, a second conductive layer on the substrate, the first and second conductive layers form a first capacitor for determining the position of the mirror. The sliding mode control can be implemented using various drive mechanisms, including electrostatic drives. When used with electrostatic drives, conductive layers that create the capacitors can also be used to drive the mirror. The detection-drive system can be time multiplexed to simplify implementation and to avoid cross talk.

Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.

Abstract: An array of movable MEMS mirror devices is provided having a high linear mirror fill factor. The array includes a base structure and selectively movable mirror structures pivotally mounted on the base structure. Each mirror structure is pivotally supported by a flexure connected to the base structure. The mirror structures each include a reflective surface portion, which is arranged in close proximity to the reflective surface portions of other mirror structures and in a generally linear alignment, forming a row structure. The flexures supporting adjacent mirror structures are staggered on opposite sides of the row structure.

Abstract: The present invention is directed to a control system for a MEMS device, such as a MEMS mirror, that uses sliding mode analysis to accurately and predictably control the position of the mirrors in a MEMS device. The present invention also uses the capacitance of the mirror to detect the position of the mirror. In one embodiment, a MEMS mirror device mounted on a substrate is described that includes, a micro mirror that is pivotable about an axis, a first conductive layer on the mirror, a second conductive layer on the substrate, the first and second conductive layers form a first capacitor for determining the position of the mirror. The sliding mode control can be implemented using various drive mechanisms, including electrostatic drives. When used with electrostatic drives, conductive layers that create the capacitors can also be used to drive the mirror. The detection-drive system can be time multiplexed to simplify implementation and to avoid cross talk.

Abstract: The present invention is directed to a control system for a MEMS device, such as a MEMS mirror, that uses sliding mode analysis to accurately and predictably control the position of the mirrors in a MEMS device. The present invention also uses the capacitance of the mirror to detect the position of the mirror. In one embodiment, a MEMS mirror device mounted on a substrate is described that includes, a micro mirror that is pivotable about an axis, a first conductive layer on the mirror, a second conductive layer on the substrate, the first and second conductive layers form a first capacitor for determining the position of the mirror. The sliding mode control can be implemented using various drive mechanisms, including electrostatic drives. When used with electrostatic drives, conductive layers that create the capacitors can also be used to drive the mirror. The detection-drive system can be time multiplexed to simplify implementation and to avoid cross talk.

Abstract: An array of movable MEMS mirror devices is provided having a high linear mirror fill factor. The array includes a base structure and selectively movable mirror structures pivotally mounted on the base structure. Each mirror structure is pivotally supported by a flexure connected to the base structure. The mirror structures each include a reflective surface portion, which is arranged in close proximity to the reflective surface portions of other mirror structures and in a generally linear alignment, forming a row structure. The flexures supporting adjacent mirror structures are staggered on opposite sides of the row structure.

Abstract: One embodiment is directed to a gimbal mechanism for a MEMS mirror device having folded flexure hinges. Another embodiment is directed to a gimbal mechanism having a frame with through-holes or recesses distributed thereabout to reduce weight of said frame. Other embodiments are directed to improved electrode structures for electrostatically actuated MEMS devices. Other embodiments are directed to methods for fabricating electrodes for electrostatically actuated MEMS devices. Other embodiments are directed to methods of fabricating through-wafer interconnect devices. Other embodiments are directed to MEMS mirror array packaging. Other embodiments are directed to electrostatically actuated MEMS devices having driver circuits integrated therewith. Other embodiments are directed to methods of patterning wafers with a plurality of through-holes. Other embodiments are directed to methods of forming moveable structures in MEMS devices.