Patents by Inventor Carlos Peralta

Carlos Peralta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240427390
    Abstract: A processor unit includes a cooling unit for dedicated cooling of a processor device that includes at least one processor. The cooling unit includes a pumped liquid loop that circulates a working fluid to remove heat from the processor device, and to transmit that heat to a passive radiator thermally coupled to the liquid loop, to radiate the heat to an external environment. The cooling unit may be used in conjunction with additional cooling of a board, such as a printed wiring board, to which the processor device is operatively and thermally coupled. The cooling unit may be part of a spacecraft, and may enable use of high-powered processing devices as part of such spacecraft.
    Type: Application
    Filed: June 22, 2023
    Publication date: December 26, 2024
    Applicant: Raytheon Company
    Inventors: Christopher M. Cosner, Carlos Peralta
  • Publication number: 20240400232
    Abstract: A space vehicle includes a massless payload. The massless payload comprises dynamically modifiable software configured to indicate one or more actions to be taken by the space vehicle. The space vehicle also includes a primary controller that includes software that is not modified based on modifications to the massless payload, a test controller operatively communicating with the massless payload. The system also includes one or more operational systems including at least one of actuators or sensors of the space vehicle that are controlled based on commands from the test controller during a test condition generated to implement the one or more actions indicated by the massless payload and by the primary controller during normal operation.
    Type: Application
    Filed: May 6, 2022
    Publication date: December 5, 2024
    Inventors: Christopher Mark Cosner, Pavan Daryanani, Joseph Daniel Khair, Orion Derek Radtke, Carlos Peralta, Jared Dean Stallings, Jason D. Yingst, Dane Kornasiewicz
  • Patent number: 10236611
    Abstract: A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: March 19, 2019
    Assignee: RAYTHEON COMPANY
    Inventors: Carlos Peralta, Kevin M. Nakano, Christal J. Sumner, John P. Norbutas
  • Publication number: 20180145435
    Abstract: A printed circuit board assembly and method for electrically communicating between a first printed circuit board and a second printed circuit board is disclosed. The method includes coupling the first printed circuit board to the second printed circuit board via an electrical communication cable. The electrical communication cable includes a VPX-compliant electrical interface, a flat flex interface, and a flexible cable that electrically couples the VPX-compliant electrical interface to the flat flex interface; and electrically communicating over the electrical communication cable.
    Type: Application
    Filed: November 17, 2017
    Publication date: May 24, 2018
    Inventors: Carlos Peralta, Kevin M. Nakano, Christal J. Sumner, John P. Norbutas