Patents by Inventor Carlos S. Sanchez

Carlos S. Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7554531
    Abstract: The present invention determines angular position using a potentiometric touch sensor. The sensor has an annular pattern of resistive material on a portion of a bottom substrate top surface. Conductive drive lines and fixed potential conductive traces radially traverse the bottom substrate top surface and are electrically coupled to the resistive material. Conductive sense traces radially traverse the bottom substrate top surface. A conductive layer on a bottom surface of a top substrate is positioned above the bottom substrate top surface. A pressure applied to the top substrate and/or the bottom substrate electrically couples a portion of a conductive sense trace to a portion of the annular pattern and/or a fixed potential conductive trace. The angular position of the applied pressure is determined by measuring at least one electrical parameter between a conductive drive line and a conductive sense line having the conductive sense traces.
    Type: Grant
    Filed: December 2, 2005
    Date of Patent: June 30, 2009
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez
  • Patent number: 7310089
    Abstract: The present invention determines angular position using a potentiometric touch sensor. The sensor has an annular pattern of resistive material on a bottom substrate top surface. Conductive drive lines radially traverse the resistive material so as to make electrical connection with the resistive material. A top substrate is spaced above the top surface of the bottom substrate. A conductive sense layer on a bottom surface of the top substrate is positioned above the resistive material. Pressure applied to either the top substrate or the bottom substrate, such as by the touch of a user, causes a portion of the conductive sense layer to contact a corresponding portion of the annular pattern of resistive material. The angular position of the applied pressure can be determined by measuring at least one electrical parameter between at least one of the conductive drive lines and the conductive sense layer.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: December 18, 2007
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez
  • Patent number: 7213323
    Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: May 8, 2007
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez, Patrick H. Bair
  • Patent number: 7113179
    Abstract: A force sensing resistor includes two substrates. Conductive traces including first, common, and calibration fingers are on the first substrate and define a contact area. A spacer surrounds the contact area and attaches the substrates together such that a cavity separates the substrates in the contact area. A first resistive layer is on the second substrate and arranged within the cavity. In response to a force moving one substrate, the first resistive layer electrically connects the first and common fingers with a resistance dependent upon resistivity of the first resistive layer and the applied force to produce an electrical signal indicative of the applied force. A second resistive layer is arranged within the cavity and electrically connects the calibration and common fingers with a resistance dependent upon resistivity of the second resistive layer to produce an electrical signal indicative of the resistivity of the second resistive layer.
    Type: Grant
    Filed: June 23, 2004
    Date of Patent: September 26, 2006
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez
  • Patent number: 7050045
    Abstract: A pointing device may be directly soldered to a printed circuit board. In one embodiment, a bottom substrate defines a sensing region with a plurality of interdigitated conductive trace regions. Each trace region includes interdigitated common and sense traces. At least one via passes through the bottom substrate for each trace. Each via supports a conductive path from one trace to at least one lead element. Each lead element is solderable to a printed circuit board. A flexible substrate is constructed from a heat resistant polymer. The flexible substrate has a resistive layer deposited on a bottom side. A raised pedestal is formed on the bottom substrate top face around at least a portion of the sensing region. The pedestal separates the interdigitated conductive traces from the flexible substrate resistive layer. A button on a keypad membrane may be used to depress the flexible substrate onto the trace region.
    Type: Grant
    Filed: January 7, 2003
    Date of Patent: May 23, 2006
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez, James D. Tickle
  • Patent number: 6909354
    Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
    Type: Grant
    Filed: February 5, 2002
    Date of Patent: June 21, 2005
    Assignee: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez
  • Publication number: 20040130528
    Abstract: A pointing device may be directly soldered to a printed circuit board. In one embodiment, a bottom substrate defines a sensing region with a plurality of interdigitated conductive trace regions. Each trace region includes interdigitated common and sense traces. At least one via passes through the bottom substrate for each trace. Each via supports a conductive path from one trace to at least one lead element. Each lead element is solderable to a printed circuit board. A flexible substrate is constructed from a heat resistant polymer. The flexible substrate has a resistive layer deposited on a bottom side. A raised pedestal is formed on the bottom substrate top face around at least a portion of the sensing region. The pedestal separates the interdigitated conductive traces from the flexible substrate resistive layer. A button on a keypad membrane may be used to depress the flexible substrate onto the trace region.
    Type: Application
    Filed: January 7, 2003
    Publication date: July 8, 2004
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez, James D. Tickle
  • Publication number: 20020104369
    Abstract: The cost and complexity of an electronic pressure sensitive transducer are decreased by constructing such a transducer directly on a printed circuit board containing support electronics. Conductive traces are formed on the printed circuit board to define a contact area. A flexible substrate having an inner surface is positioned over the contact area. An adhesive spacer, substantially surrounding the contact area, attaches the flexible substrate to the printed circuit board. At least one resistive layer is deposited on the flexible substrate inner surface. In use, the resistive layer contacts at least two conductive traces in response to pressure applied to the flexible substrate to produce an electrical signal indicative of applied pressure.
    Type: Application
    Filed: February 5, 2002
    Publication date: August 8, 2002
    Applicant: Interlink Electronics, Inc.
    Inventors: Jeffrey R. Baker, Carlos S. Sanchez