Abstract: Disclosed are epoxy resin compositions which include an alkali metal containing cure accelerator. The alkali metal containing cure accelerators are preferably alkali metal hydroxides, alkoxides, carboxylates, or alkali metal salts. Articles prepared from the resin compositions of the invention exhibit enhanced thermal properties, and similar non-thermal properties, when compared to articles prepared from compositions including other accelerators such as imidazoles. The resin compositions of the invention may be used for any purpose, but are particularly suited to be utilized in the manufacture of laminates for printed circuit boards and non-electrical structural applications.