Patents by Inventor Carlton T. Creamer

Carlton T. Creamer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11581299
    Abstract: Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit. The common wafer template includes a plurality of transistors, a plurality of resistors, a plurality of capacitors, and a plurality of bond pads. Final circuit customization of the common wafer template is accomplished by adding at least one metal layer that forms interconnects to passive and active elements in the template in order to complete the circuit.
    Type: Grant
    Filed: March 12, 2020
    Date of Patent: February 14, 2023
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Carlton T. Creamer, Daniel C. Boire, Kanin Chu, Hong M. Lu, Bernard J. Schmanski
  • Patent number: 10784826
    Abstract: The present disclosure provide a device, system, and method for generating, in an electrical device, a 1 bit or a 0 bit that is received in a switching circuit powered by a battery. The device, system, and method generates, in the switching circuit, a negative bias voltage and a positive bias voltage. The device, system, and method transmits the negative bias voltage and the positive bias voltage to a power amplifier. The device, system, and method turns the power amplifier from an off-state to an on-state in response to receiving the negative bias voltage. The device, system, and method amplifies, with the power amplifier, a power signal moving through power amplifier when the amplifier is in the on-state.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: September 22, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Carlton T. Creamer, Christopher R. Bye, Vali Touba, Stephen J Creane
  • Publication number: 20200294987
    Abstract: Techniques and architecture are disclosed for a method for making a custom circuit comprising forming a common wafer template, selecting at least two elements of the common wafer template to be chosen elements, and adding at least one metal layer to interconnect the chosen elements to form a circuit. The common wafer template includes a plurality of transistors, a plurality of resistors, a plurality of capacitors, and a plurality of bond pads. Final circuit customization of the common wafer template is accomplished by adding at least one metal layer that forms interconnects to passive and active elements in the template in order to complete the circuit.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Carlton T. Creamer, Daniel C. Boire, Kanin Chu, Hong M. Lu, Bernard J. Schmanski
  • Publication number: 20200136571
    Abstract: The present disclosure provide a device, system, and method for generating, in an electrical device, a 1 bit or a 0 bit that is received in a switching circuit powered by a battery. The device, system, and method generates, in the switching circuit, a negative bias voltage and a positive bias voltage. The device, system, and method transmits the negative bias voltage and the positive bias voltage to a power amplifier. The device, system, and method turns the power amplifier from an off-state to an on-state in response to receiving the negative bias voltage. The device, system, and method amplifies, with the power amplifier, a power signal moving through power amplifier when the amplifier is in the on-state.
    Type: Application
    Filed: October 24, 2018
    Publication date: April 30, 2020
    Inventors: Carlton T. Creamer, Christopher R. Bye, Vali Touba, Stephen J Creane
  • Patent number: 10529820
    Abstract: A GaN on diamond wafer and method for manufacturing the same is provided. The method comprising: disposing a GaN device or wafer on a substrate, having a nucleation layer disposed between the substrate and a GaN layer; affixing the device to a handling wafer; removing the substrate and substantially all the nucleation layer; and bonding the GaN layer to a diamond substrate.
    Type: Grant
    Filed: July 15, 2015
    Date of Patent: January 7, 2020
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Kanin Chu, Pane Chane Chao, Carlton T Creamer
  • Publication number: 20190043709
    Abstract: A GaN on diamond wafer and method for manufacturing the same is provided. The method comprising: disposing a GaN device or wafer on a substrate, having a nucleation layer disposed between the substrate and a GaN layer; affixing the device to a handling wafer; removing the substrate and substantially all the nucleation layer; and bonding the GaN layer to a diamond substrate.
    Type: Application
    Filed: July 15, 2015
    Publication date: February 7, 2019
    Inventors: Kanin Chu, Pane Chane Chao, Carlton T. Creamer