Abstract: A tool for the linear polishing of substrates includes an endless belt of continuous strength wrapped substantially as a helix of predetermined length and width with a 180 degree twist along the length to increase by a factor of 2× the time interval between which belt changes need to be made because of wear-and-tear, significantly reducing the costs associated with the polishing because of reduced down time. In a preferred embodiment for the chemical-mechanical polishing of silicon wafer substrates used in fabricating integrated circuits, the endless belt is constructed as a Mobius strip of a rubberized, urethane composition to be flexible, but yet strong enough to withstand the applied pressure between the polishing belt and the substrate.