Abstract: A method and apparatus for cleaning apertures within an input manifold of a semiconductor fabrication deposition tool is presented. Vapor phase chemicals that contain the required constituents are introduced into the tool through the input manifold. The apertures of the input manifold direct the gas flow towards the surface of the wafer where they are absorbed and react to form thin films. Film accumulates on the wafers but also in other places inside the chamber of the reactor. Those places include the sidewall surfaces of the gas delivery apertures. Apertures deposits can source contaminants thereby causing defects on the wafers. The presented cleaning mechanism is operably sealed to the input manifold on one end and to a vacuum pump at the other end. The vacuum cleaner comprises a rotating plate with a radial slot. Air flows from the input manifold, through the apertures, through the slot, and to the vacuum pump.