Abstract: A method for packaging a die includes attaching the die to a substrate using a plurality of pieces of discontinuous die attach material, and injecting a mold compound at the interface between the die and the substrate.

Abstract: Some embodiments relate to a semiconducting device that includes a substrate, a die and an interconnect device. The die and interconnect device are attached to an upper surface of the substrate. The semiconducting device further includes a first wire that is bonded to the substrate and to the interconnect device and a second wire that is bonded to the interconnect device and to the die. Other example embodiments include a stack of dice that has a bottom die attached to the upper surface of the substrate and a top die stacked onto the other dice in the stack of dice. The interconnect device is attached to an upper surface of any die in the stack of dice such that a first wire is bonded to the substrate and to the interconnect device and a second wire is bonded to the interconnect device and to the top die.