Patents by Inventor Carmelo Engracia Baquiano

Carmelo Engracia Baquiano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature
    Patent number: 8937807
    Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: January 20, 2015
    Assignee: Emerson Network Power—Embedded Computing, Inc.
    Inventors: Carmelo Engracia Baquiano, Carmelo Delovino Cayaban, Paul Francis Brosas Montalbo, Joseph Estorgio Celocia
  • Circuit Board Heatsink and Heatframe Structures With Heater Element For Circuit Board Operation At Below Zero Temperature
    Publication number: 20130128452
    Abstract: A circuit board assembly including a heating device operated during cold boot startup includes a circuit board having a computer component. A thermal transfer device connected to the circuit board assembly acts when the computer component is operating to remove heat generated by the computer component. A heating device operates to heat the thermal transfer device. A field programmable gate array acts to energize the heating device when a temperature defining a cold startup condition at the computer component or the thermal transfer device is sensed. The thermal transfer device when heated by the heating device heats the computer component to greater than the temperature of the cold startup condition. A control device connected to the heating device provides an operational mode of the heating device.
    Type: Application
    Filed: November 21, 2011
    Publication date: May 23, 2013
    Applicant: EMERSON NETWORK POWER - EMBEDDED COMPUTING, INC.
    Inventors: Carmelo Engracia Baquiano, Carmelo Delovino Cayaban, Paul Francis Brosas Montalbo, Joseph Estorgio Celocia